Teradyne - Semiconductor Test Division

Semiconductor Test is a lead-ing supplier of semiconductor test equipment for logic, RF, analog, power, mixed-signal, and memory technologies. We deliver test solutions to developers and manufacturers of a broad range of integrated circuits, packaged separately or integrated as System-On-a-Chip (SOC) or System-In-Package (SIP) devices. ICs tested by Teradyne are used in computing, communications, consumer, automotive, identification, and internet applications.

D750Ex Key Attributes

The D750Ex addresses the key market trends with the following key attributes:

 

Provides Lowest Cost of Test for Falling Device ASP's

  • Faster test time than current solutions by 20 to 60%
    • True Resource per pin Architecture (LCD, HSD, APMU, DPS)
    • Dual DSP architecture for Grayscale algorithms
  • Higher parallel efficiency >97%
    • True Resource per pin architecture, no shared resources
    • Dual DSP architecture, parallel embedded  & centralized
    • IG-XL Pure Parallel™ Software
  • Greater parallelism with up to 32 sites
    • High density instrumentation

 

Flexible Production Capacity to Meet Changing Needs

  • Configurable for swing production
    • Universal Slots for (LCD, HSD and APMU pins)
    • Compatibility with existing J750 instrumentation
    • Compatible docking and production interfaces from current J750
    • Upgradeable from J750

 

Limited Production Floor Space Requires a Small Footprint


  • Zero footprint for Probe = up to 80% test floor space saving
  • Up to 50% test floor savings at Final Test
    • No floor space increase for small or large configurations

 

Largest Support Network
  • Large Installed Base of J750 platform system and Service and Applications personnel
    • Proven economic solution in Microcontroller, Image Sensor and Consumer Digital Segments
    • Largest Support Infrastructure outside of Japan

 

 

Configurations >

 
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