Teradyne - Semiconductor Test Division

Semiconductor Test is a lead-ing supplier of semiconductor test equipment for logic, RF, analog, power, mixed-signal, and memory technologies. We deliver test solutions to developers and manufacturers of a broad range of integrated circuits, packaged separately or integrated as System-On-a-Chip (SOC) or System-In-Package (SIP) devices. ICs tested by Teradyne are used in computing, communications, consumer, automotive, identification, and internet applications.

Market Trends

 

Large panel Multi-channel source driver ICs (>600 drivers per package) are the fastest growing segment expected to grow in unit volume by 43% CAGR from 2007 to 2011. Multi-channel source driver segment will represent 55% of the total IC revenue in 2008 and is forecasted to grow to over 90% by 2011.
 
 
Driver resolution is increasing to 10-14bit performance. The increased device complexity requires a test system that has enough DSP processing power designed to handle the increase in data processing. Data rate will increase to support full HD TV with higher frame rates (120Hz). Bus standard mLDVS has become the mainstream TV interface to driver ICs. Other bus standards like PPDS, PPmL, MiPi and AiPi are being investigated as alternate means of communication (>650Mbps).  Development of CDAC drivers is well underway to support the higher performance high definition TV performance.
Hand held and mobile devices are rapidly transitioning from TFT-LCD to LTPS for higher performance on larger resolution and panel size. Many new phone designs are making use of the lower power consumption of OLED displays. Mobile Driver IC s are moving to 8-bit color TFT-LCD QVGA driver output with 1040 pins. Newer LTPS-LCD QVGA driver outputs 240-320 pins.
  • MIPI (Mobile Industry Processor Interface)
  • AIPI (Advanced Intra Panel Interface)
  • PPDS (Point to Point Differential Signaling), is a registered trademark of National Semiconductor Corporation
  • PPmL (Point to Point mini-LVDS)

 

 

 

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