Teradyne - Semiconductor Test Division

Semiconductor Test is a lead-ing supplier of semiconductor test equipment for logic, RF, analog, power, mixed-signal, and memory technologies. We deliver test solutions to developers and manufacturers of a broad range of integrated circuits, packaged separately or integrated as System-On-a-Chip (SOC) or System-In-Package (SIP) devices. ICs tested by Teradyne are used in computing, communications, consumer, automotive, identification, and internet applications.

J750

System Options

Take a look at some of the J750 system options:

 

J750 Enhanced Digital Channel Board

The new Enhanced Digital Channel Board for the J750 improves edge placement accuracy from 500 ps to 325 ps, enabling customers to improve yields, increase device specifications, and achieve significant savings in manufacturing.

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200 MHz Clock Module

The new 200 MHz Clock Module for the J750 delivers 2 independent fully calibrated clock signals up to 200 MHz without limitations in characterization and production.

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Analog Pin Measurement Unit

Teradyne adds the Analog Pin Measurement Unit (APMU) to its set of analog instrumentation, helping to address the semiconductor manufacturer's need to further cut the cost of testing mixed-signal devices!

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RFID Option

The RFID Option is ideal for testing RFID interfaces ted into VLSI devices like Smartcards and I.D. tag applications. These devices are commonly found in banking, telephone, health insurance cards and luggage tags as well as a variety of other applications. The J750 RFID Option provides 16 bi-directional RFID channels including transmitter and receiver path with synchronization and DSP units. A single RFID board can support parallel test up to 16 sites, two may support up to 32 sites. Teradyne provides a complete, economical test solution with no additional hardware interfaces needed to test these types of devices more accurately and efficiently.

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Memory Test Option

The J750 Memory Test Option provides the hardware and software needed to test large embedded FLASH, DRAM, ROM and EEPROM found on today's VLSI devices.

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16M LVM

The 16M Large Vector Memory (LVM) option is for customers who require additional memory for testing devices that require greater pattern depth than 4M Vector Memory.

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J750 Mixed-Signal Option

Lowest Cost Test Solution for Mixed-Signal Devices
The Test Division engineered unique software and hardware to test low-end mixed-signal devices. A new graphical programming environment was developed to address the specific requirements of testing mixed-signal devices. The J750 Mixed Signal Option consists of a Low-to-Mid Frequency (LMF) Analog Source I/O Module (ASIO) and a companion Digital I/O Module (DSIO). Both provide multiple device test channels on each module, with up to 32 instruments or sites supported in the J750 test system.

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Converter Test Option

The Converter Test Option (CTO) contains 8 high accuracy source and 8 high accuracy capture channels on one board.

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