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Assembly Test & Inspection Solutions
News & Events
Press Releases
01/10/2012 - UBM Electronics Announces the Finalists for the Test & Measurement World Best in Test Awards
02/22/2012 - Teradyne Presents Evolving In-Circuit Technologies at IPC APEX EXPO 2012
03/07/2012 - Teradyne Revamps Support Network Program, Introduces TSN Select Membership Level
04/19/2012 - Teradyne to Demonstrate Cost Effective Functional Test at NEPCON China 2012
05/11/2012 - Teradyne and Corelis Announce Agreement to Bolster Boundary-Scan In-Circuit Test Capability
12/05/2012 - UBM Tech’s Test & Measurement World Announces the Best in Test Finalists
 
Upcoming Events Location Date
IPC APEX EXPO San Diego Convention Center, San Diego, CA February 19–21, 2013

Stay updated on Teradyne's latest news and upcoming events!

Past Events Location Date
ITC Test Week Disneyland Hotel, Anaheim, CA November 4-9, 2012
SMTA International Conference Walt Disney World Dolphin, Orlando, Florida October 14-16, 2012
NEPCON Shanghai
Booth: 1G90 a
Shanghai, China April 25-27, 2012
Goepel UK "TechDays"
Presentation: Teradyne's John Walley
Imperial War Museum in Duxford, Cambridge, UK March 8, 2012
IPC APEX Expo
Test I: In Circuit Test
"Integrated Electrical Test within the Production Line," author Michael Smith. Presented by Alan Albee

Design for Test (DFT)
Presentation: "Virtual Access Technique Augments Test Coverage on Limited Access PCB Assemblies"
Anthony Suto
San Diego, California February 28-March 1, 2012
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