Teradyne
Search   |   About Teradyne   |   Products   |   Support   |   Investors   |   Careers   |   Contact   |   Teradyne.com   |   Chinese
  ATD Search
 
News & Events
Press Room
Newsletter
Events
Web Seminars
Calendar Events
 
Request a Sales Call ? Request a Sales Call ? Click here to get more information.
Newsletter Signup! Newsletter Signup!
Click here
 
Assembly Test & Inspection Solutions
News & Events
Visit us at IPC Printed Circuits Expo!
Archive - 2008 | 2007 | 2006 | 2005 | 2004 | 2003 | 2002 | 2001

IPC Printed Circuits Expo

Equipment:
GR-X1002™ Multi-Layer Bareboard Analysis System
The GR-X1002™ is an ideal solution to inspect and identify inner layer mis-registration and drill offset defects. The mobility and small footprint of the 1002 makes it easy to roll to any part of the production line, or wherever it is needed.

Key Features:
Advanced Image Processor (AIP).
Advanced image enhancement and analysis tools software library.
Easy-to-use control panel.
Capable of imaging embedded components.
High-output 70kV X-Ray source.
Large board handling surface.
Small footprint.
Very mobile.

Dates, Location and Times...

Long Beach Convention Center
Long Beach CA USA
March 26 - 28, 2002

Visit Us at Booth #936

IPC Printed Circuits Expo hours:
Exhibits Open:
Tuesday March 26: 11a - 6p
Wednesday March 27: 10a - 6p
Thursday March 28: 10a - 3p

IPC Printed Circuits Expo

For more show information see the IPC Printed Circuits Expo website.

Learn More
   Resource Center
   Support & Services