Presenter: Michael J.
Smith, Technologist,
Teradyne, Assembly Test Division
This seminar is a practical guide to
Automatic X-Ray Inspection, as it is now becoming a major
inspection technique for high reliability PCB manufacturing.
We will explore the market forces and technologies that
are driving the use of AXI, explain the capability and
limitations of the three major techniques, transmission,
laminography and tomosynthesis and review the image quality
produced. The capability of AXI systems to directly and
indirectly render images that represent the solder joint
and potential defects, such as voids, will be discussed.
Webinar #1 - May 12, 2004 “Understanding AXI Acquisition
Techniques and Image Quality”
9:00 am
EDT call on the 12th
To register, please click
here.
1 pm EDT
call on the 12th
To register, please click
here.