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Assembly Test & Inspection Solutions
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Understanding AXI Acquisition Techniques and Image Quality
Archive - 2008 | 2007 | 2006 | 2005 | 2004 | 2003 | 2002 | 2001
Michael J.Smith Presenter: Michael J. Smith, Technologist,
Teradyne, Assembly Test Division
 
This seminar is a practical guide to Automatic X-Ray Inspection, as it is now becoming a major inspection technique for high reliability PCB manufacturing. We will explore the market forces and technologies that are driving the use of AXI, explain the capability and limitations of the three major techniques, transmission, laminography and tomosynthesis and review the image quality produced. The capability of AXI systems to directly and indirectly render images that represent the solder joint and potential defects, such as voids, will be discussed.
 
Webinar #1 - May 12, 2004
“Understanding AXI Acquisition Techniques and Image Quality”
 
9:00 am EDT call on the 12th
To register, please click here.
1 pm EDT call on the 12th
To register, please click here.
 
For more information, please email: webinar@teradyne.com

We look forward to seeing you online!

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