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Assembly Test & Inspection Solutions
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Teradyne Releases Upgrade to TestStation Software
 

— Version 5.9.0 provides UltraPin-based test systems with a powerful in-circuit test (ICT) environment for developing, debugging and running board test programs.

North Reading, MA, August 23, 2005 - Teradyne®, a leading manufacturer of high-performance board assembly test and inspection solutions, today announced a newly upgraded version of TestStation™ UltraPin-based operating software. Version 5.9.0 provides users with a powerful in-circuit test (ICT) environment for developing, debugging and running board test programs. Key new features of version 5.9.0 include FrameScan™ FX vectorless test technique, bench-top boundary scan integration tools, enhanced retest-on-fail capabilities, and hundreds of new test library models.

FrameScan™ FX Support - Version 5.9.0 software allows TestStation users to take full advantage of FrameScan FX capabilities. FrameScan FX is an advanced vectorless test technique developed by Teradyne for detecting open pins on component packages and connectors. It features improved measurement hardware and sophisticated software algorithms. Hardware improvements include a new low-noise op amp that increases the front-end gain of the active probe. Software improvements include an automatic Precision Mode that increases the number of measurement samples for more accurate detection of open pins on new micro-BGA and connector packages.

Test Generation Support for Benchtop Boundary Scan - Version 5.9.0 includes a hybrid test model that automates TestStation integration with 3rd-party bench-top boundary scan solutions. The test model permits users to specify a bench-top boundary scan vendor (such as Acculogic, Asset, Corelis, Goepel or JTAG), define the location of boundary scan test files, and choose a preferred connection (e.g., direct to fixture, through an IEEE multiplex port, or via custom function board). Once defined, the hybrid test generator automatically integrates the test code used to run the bench-top boundary scan tests with TestStation test programs for more comprehensive in-circuit fault coverage and diagnostics. This capability also permits users to reuse boundary scan tests developed at their engineering and prototype development facilities.

Enhanced Retest-On-Fail (RTOF) Capabilities - For in-line production test environments, version 5.9.0 features RTOF enhancements, including a new graphical interface, the addition of a maximum cycle count option (to limit board vacuum cycles), and the ability to set locks on each RTOF option for production test purposes.

New Test Library Models - Version 5.9.0 features a test library with 536 new digital device models. In addition, 183 of the existing library models have been updated to include the new TECHNOLOGY keyword, which allows the ICT test generator to automatically create accurate logic level assignments for all PCB nets.

More information is available online at http://www.teradyne.com/ict/teststation-in-circuit-test/testStation590.html or by calling 800.837.2396 (63.32.341.7800 in areas without toll free access).

About Teradyne

Teradyne (NYSE:TER) is a leading supplier of Automatic Test Equipment and interconnection systems. The company's products deliver competitive advantage to the world's leading semiconductor, electronics, automotive and network systems companies. In 2004, Teradyne had sales of $1.8 billion, and currently employs about 5,700 people worldwide. For more information, visit www.teradyne.com. Teradyne, TestStation and FrameScan are trademarks or registered trademarks of Teradyne, Inc.

Editorial Contact:
Peter Predella
Teradyne Asssembly Test Division
978.370.1401
peter.predella@teradyne.com

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