| Circuit
Board & Assembly Test Division Profile |
 |
5.4Mb |
MemTest™
"Fast
Ram/Rom Test Generation for the CASS Digital
Test Unit" |
|
33Kb |
MultiScan™
"Teradyne's Vectorless Test System" |
|
157Kb |
| Test & Inspection Technology Summary |
|
1.7Mb |
Resumen
Technológico de Prueba e Inspección (Spanish) |
|
686Kb |
| Teradyne
Paperless Repair Station |
|
90Kb |
"Advantages of Digital Convergence for Functional Test"
Andrew Hutchinson, Autotestcon 1998 |
|
65Kb |
"High Performance Component Software Changes the Rules for Configuring ATE"
Phillip Stern, Autotestcon 1997 |
|
82Kb |
"Management of DPMO Metrics Reduces the Cost of PCB Assembly"
Amit Verma, APEX 2003 |
|
306Kb |
"Rehosting Legacy Test Program Sets from Military ATE"
John Arena, Autotestcon 1997 |
|
69Kb |
"Functional Test in a High Density PCB Environment"
Bob Stasonis, Teradyne, Inc. |
|
280Kb |
"Open Strategy Tools Synthesize Better Defect Detection Between Multiple Inspection & Test Systems"
John Arena, Teradyne, Inc. |
|
222Kb |
"Using Microprocessor and DSP Debug Interfaces for Manufacturing Functional"
Billy Fenton, eTronix Conference 2001 |
|
50Kb |
| Design for Test Methods |
|
| Short Wire Technologies, Board Stress Analysis |
|
| Fixturing Guidelines and Best Practices |
|
| Integrated In-Line Test & Inspection |
|
"Banking on Future Technology"
Fujitsu |
|
128Kb |
"Making Strides with D2B™ (Design-to-Build) Software"
Reptron Manufacturing Services |
|
707Kb |
"The Flexible Friend"
Kapsch AG |
|
44Kb |
"The Global Provider"
Celestica |
|
135Kb |
"State of the Art at Tecwings"
Tecwings |
|
20Kb |
"Welwyn Systems on the Right Lines"
Welwyn |
|
36Kb |
ATE for Avionics
Avionics Magazine, Barry Rosenberg, September 2007 |
|
1.84Mb |
"Instruments for Automatic Test"
IEEE, Eric Trubenbach, March 2005 |
|
1.53Mb |
"Challenges
for the test engineer"
Printed Circuit Europe, Kevin Paton, April
2003 |
|
276Kb |
"Changing
Times in Test Strategy"
Electronic Packaging
and Production, Amit Verma & Paul Hannon, May 2002 |
|
597Kb |
"Complementary
Test Strategies on High-Complexity Boards"
Circuits Assembly, Amit Verma, Mark Ogden & John Kokoska, August 2000 |
|
4.64Kb |
"Effective Test Strategies for Modern Printed Circuit Assemblies"
Nov 2001 |
|
2.02Mb |
"Effective
Test Strategies for Modern Printed Circuit
Board Assemblies"
Electronics Engineering Times China, August
2002 (Chinese) |
|
1.82Mb |
"Gigabit
Ethernet Test Challenges On The Manufacturing
Floor"
EET Asia, Kevin Paton, January 2003 |
|
499Kb |
"Gigabit
Ethernet Test Challenges On The Manufacturing
Floor"
(Chinese Version 1) |
|
1.3Mb |
"Gigabit
Ethernet Test Challenges On The Manufacturing
Floor"
(Chinese Version 2) |
|
1.4Mb |
"Kostenreduktion
mittels DPMO-Methode - Teil 1"
Productronic, Amit Verma, May 2003 |
|
73Kb |
"Kostenreduktion
mittels DPMO-Methode - Teil 2"
Productronic, Amit Verma, June 2003 |
|
71Kb |
"Optimizing
Test where ICT Access is Limited"
October 2002 |
|
286Kb |
"Step
by Step: Test/Inspection"
Surface Mount Technology,
Michael J. Smith, September 2002 |
|
88Kb |
"Switching
to Lead-Free Solder: Test & Inspection
Issues"
OnBoard Technology, Michael J. Smith, April
2004 |
|
395Kb |
"Teradyne
Pushes for Overall Test Solution"
Electronic Engineering Times
Asia, Mario Pereira, September 2002 |
|
52Kb |
"Test
and Inspection"
Surface Mount Technology, John Arena & Roy McKenzie,
Oct 2001 |
|
75Kb |
"The
Framework Implementation Project"
Circuits Assembly, Andrew Dugenske, March 2001 |
|
114Kb |
"The
Functional Test Revival"
Printed Circuit Europe, June 2001 |
|
560Kb |
"Une
stratégie de test? C'est d'abord une
question de dosage des différentes
techniques."
Mesures, Amit Verma, April 2003 |
|
7.2Mb |
"Ericsson
Creates Innovative Test Solutions with the
Help of Teradyne"
Teradyne Quarterly Newsletter, July 1999 |
|
119Kb |
