Business Issues & Technology Drivers

A series of three complimentary Web-based seminars. Titled “Are You Ready for 2004?,” the three-part series is designed to prepare you for the test and inspection challenges you will face this year.

Teradyne’s Webinar series features Teradyne technologist Michael J. Smith, an industry expert on PCB test and inspection. Attend this three-part Webinar series to find out what test & inspection issues you will face in 2004 and how to deal with them.

The first Webinar on Wednesday, January 21 covered the business issues and technology drivers that are shaping PCB test and inspection.

The series will continue in Q1 2004 with two additional Webinars:

• “The Impact of Lead-Free Solder on PCB Test & Inspection” - March 3, 2004
• “Impact of Low-Voltage Devices on Test and Inspection”

For more information, click here

About the speaker:

Michael J. Smith, the Webinar series presenter, has over twenty years of experience with Automatic Test Equipment starting with simulator based functional test systems in the early 80’s, through to traditional electrical inspection systems, image based inspection systems and process monitoring and control. He has written numerous papers and articles as well as being the National Electronics Manufacturing Initiative (NEMI) Roadmapping Chair for Test and Inspection in 2000 and 2002 and IPC Technical Committee Member for APEX 2002, 2003, and 2004.