Understanding AXI Acquisition Techniques and Image Quality

This seminar is a practical guide to Automatic X-Ray Inspection, as it is now becoming a major inspection technique for high reliability PCB manufacturing. We will explore the market forces and technologies that are driving the use of AXI, explain the capability and limitations of the three major techniques, transmission, laminography and tomosynthesis and review the image quality produced. The capability of AXI systems to directly and indirectly render images that represent the solder joint and potential defects, such as voids, will be discussed.

About the speaker:

Michael J. Smith, the Webinar series presenter, has over twenty years of experience with Automatic Test Equipment starting with simulator based functional test systems in the early 80’s, through to traditional electrical inspection systems, image based inspection systems and process monitoring and control. He has written numerous papers and articles as well as being the National Electronics Manufacturing Initiative (NEMI) Roadmapping Chair for Test and Inspection in 2000 and 2002 and IPC Technical Committee Member for APEX 2002, 2003, and 2004.