New assembly technologies are forcing PCB manufacturers to modify their test and inspection methodologies. Electronic Trend Publications estimates that due to the onslaught of area array packaging, half of all solder connections will be invisible to automated optical inspection (AOI) systems by 2007. The problem worsens as board complexities increase, lead-free solder materials are introduced, RF circuits use shields and covers, and higher frequency/lower voltage devices restrict electrical testing. In the coming years, board manufacturers will face greater inspection challenges as loss of visual and electrical access climb to new proportions.

Automated X-Ray inspection (AXI) is gaining in popularity because, like its counterpart (AOI), X-Ray is non-evasive. But unlike AOI, X-Ray imaging is not hindered by ball grid array devices, component shields, heat sinks and high density (high joint count) double-sided boards. And when integrated with in-circuit test, AXI equipment can increase fault coverage to nearly 100% of all process and electrical defect classes.

Teradyne recently introduced a new AXI technology, called ClearVue™, a revolutionary 3-D imaging system that maximizes coverage, throughput and reliability. ClearVue is unique in its ability to more accurately detect subtle defects and manufacturing flaws, even as board complexities grow. Compared to legacy laminography-based AXI technologies, ClearVue has many advantages. We welcome you to learn more by clicking here.

Our growing family of XStation™ X-Ray inspection equipment is widely considered the best in the industry. The XStation MX is our full-featured flagship product. It includes our ClearVue technology, TraX™ with expanded field-of-view capability, XStat™ statistical process control module, Strategist™ coverage planning software, XVer repair verification module and X-Frame™, an integrated program development environment.