ClearVue 3D X-Ray Inspection Technology
ClearVue™ 3D imaging technology provides the highest level of fault coverage with the lowest Fals e Call Rates in the Industry.
This performance is achieved by using static images to reconstruct a tomosynthetic slice. By using this technique ClearVue removes all mechanical motion and averaging from the reconstructed slice.
The capability of ClearVue to slice at ~ 1 mil intervals in Z, with its clear advantage in imaging quality enables this technology to provide the highest fault coverage while keeping false fails to the lowest possible levels.
Shorts |
Tombstones/Billboards |
Opens |
Solder ball |
Insufficient Soldier |
BGA |
Excess Soldier |
Void |
Passives |
Leaded Components |
Misaligned |
Lifted leads |
Presence/Absence |
Reversed tantulum capacitor |
|
|
The Cost of high False Calls
If you are using AXI or AOI today, take a look at the cost of inaccurate
diagnostics. Are you using a system with 3000, 5000, 10000 ppmJ or
more false fail rates, the cost of these errors is high.
XStation MX provides the following savings:
- Reduced escapes
- Expense reduction around the repair and verification process
- Reduction of component and product scrap
- Reduced repair and verification cycle times
|
