Business Milestones: 1960s 1970s 1980s 1990s 2000s
Technical Milestones: 1960s 1970s 1980s 1990s 2000s
Business Milestones
1960s
1960: Teradyne founded in Boston, MA by Alex d'Arbeloff and Nick DeWolf. - 1961: First product, the D133 diode tester, sold to Raytheon Company.
- 1967: Teradyne moves headquarters to eight-story, 165,000 square-foot building at 183 Essex Street, Boston, from loft above Joe & Nemo's hot dog stand.
- 1968: Teradyne Components (now Teradyne Connection Systems) founded in Lowell, MA, to develop backplane assemblies and connectors.
- 1968: Teradyne launches Teradyne Dynamic Systems to develop digital semiconductor test systems in Chatsworth, CA.
1970s
- 1970: Teradyne becomes a publicly owned company.
- 1971: Alex d'Arbeloff is named President of Teradyne.
- 1973: Teradyne establishes a direct sales organization, Teradyne Japan Ltd., in Tokyo.
- 1973: Teradyne launches Teradyne Central in Illinois to develop telecommunications test systems.
- 1974: Teradyne acquires 245,000 square-foot building at 179 Lincoln Street, Boston, MA, new home to circuit board test and central operations groups.
- 1979: Teradyne is listed on the New York Stock Exchange (symbol TER).
- 1979: Teradyne passes $100 million in sales, posting revenues of $122 million.
1980s
- 1980: Teradyne acquires 245,000 square-foot building at 321 Harrison Avenue, Boston, MA, new
corporate headquarters and home to the Industrial Consumer Division.
- 1980: Teradyne Connection Systems moves headquarters to new 240,000 square foot plant in Nashua, NH.
- 1981: Construction begins in Deerfield, IL, for new headquarters of Teradyne's Telecommunications Division.
- 1981: Teradyne receives $35 million order for 4TEL subscriber-line test systems from GTE; it's the largest order in Teradyne's history.
- 1982: First 4TEL system installed in Europe at British Telecom.
- 1987: Teradyne acquires Zehntel, Inc.(Walnut Creek, CA), a leading supplier of in-circuit board test systems.
- 1987: Memory and VLSI test divisions move into new 360,000 square foot facility in Agoura Hills, CA.
- 1989: Teradyne becomes a founding member of the Center for the Quality of Management, a non-profit consortium of seven companies committed to Total Quality Management (TQM).
1990s
- 1990: Teradyne launches company-wide TQM initiative.
- 1991: Teradyne celebrates first company-wide TQM Day.
- 1993: Teradyne receives $63 million order from Deutsche Telekom for 4TEL telecommunications
test systems, a record for the company.
- 1993: Teradyne ships the 1000th Z1800-Series manufacturing process test system.
- 1994: 1000th Quality Improvement Team completes its mission.
- 1994: Teradyne establishes Software and Systems Test, the company's first business unit dedicated to software testing.
- 1995: Teradyne ships the 500th A500 Family test system.
- 1995: Teradyne receives $56 million order to supply depot test systems for the B-2 Stealth Bomber, the largest board-test order in the company's history .
- 1995: Teradyne acquires Megatest Corporation (San Jose, CA), a leading supplier of semiconductor test equipment.
- 1995: Teradyne acquires Hammer Technologies (Wilmington, MA), a pioneer developer of computer telephony test systems.
- 1995: Teradyne passes $1 billion in sales.
- 1995: George Chamillard succeeds Alex d'Arbeloff as President of Teradyne and is named Chief Operating Officer. Alex d'Arbeloff remains Chairman of the Board and Chief Executive Officer.
- 1995: Over 1000 Quality Improvement Teams (QITs) are completed in one year; over 3000 QITs have been completed since 1990.
- 1996: Teradyne launches major new TQM activity: Revolutionizing Product Development (RPD) - a systematic means to apply TQM methods to the complex process of product design and development.
- 1996: Teradyne Connection Systems expands Nashua, NH factory to 400,000 square feet.
- 1996: Teradyne acquires Midnight Networks Inc. (Waltham, MA), a pioneer in the field of computer network validation.
- 1996: Teradyne acquires Control Automation (Princeton, NJ), the market leader in automated optical inspection systems used for printed circuit board manufacturing.
- 1997: Completion of 5000th QIT.
- 1997: First RPD Workshops launched.
- 1998: Teradyne tests more than 100 million telephone lines.
- 1998: Teradyne Japan celebrates 25 years; expands in Kumamoto.
- 1998: Connection Systems expands Circuit Operation.
- 1998: Completion of 6000th QIT.
- 1999: Teradyne invests in LogicVision to share in development of future test solutions that integrate traditional ATE with Built-In Self Test (BIST).
- 1999: Teradyne opens new 270,000 square foot complex in North Reading, MA.
- 1999: Teradyne included in S&P 500.
2000s
- 2000: INDUSTRYWEEK Magazine selects Teradyne as one of the world’s 100 Best-Managed Companies
- 2000: Teradyne ships 500th J750 Test System
- 2000: Alex d'Arbeloff retires from Teradyne
- 2000: Alex d`Arbeloff receives Lifetime Contribution Award to the Test World
- 2000: Teradyne ADSL Test System receives SMT Vision Award
- 2000: Teradyne Assembly Test Division wins Design News’ Design Quality Award
- 2000: Teradyne test equipment and software nominated for Evaluation Engineering Readers’ Choice Award
- 2000: Teradyne ADSL Test System receives ‘The Best in Test’ Award
- 2001: Teradyne Number 1 in Boston Globe 100: Best of Massachusetts Businesses
- 2001: Teradyne ships 750th J750 test system
- 2001: Teradyne acquires GenRad
- 2002: Teradyne establishes a technical support center in Shanghai
- 2002: Teradyne receives Service Excellence Awards at APEX
- 2002: Optima 7350 AOI system named "Best in Test"
- 2002: 1000th Catalyst SOC test system ships
- 2003: Teradyne officially opens its new Shanghai facility
- 2003: FLEX Test System named "Best in Test"
- 2003: 100th Tiger SOC test system ships
- 2003: Teradyne receives service excellence award at APEX
- 2004: Teradyne places in ’10 BEST’ Suppliers for VLSI Research Survey
- 2004: Teradyne establishes University Scholarship Program in China
- 2004: Teradyne lands $67M B-1B Lancer Contract
- 2004: Delta Air Lines selects Teradyne’s NxGen Automated Test System for commercial avionics support
- 2004: Microchip Technology recognizes Teradyne with 2003 Supplier of the Year Award
- 2005: Teradyne wins prestigious Best-in-Test(TM) Award
- 2005: Teradyne celebrates Chung Yuan Christian University's 50-Year Anniversary; donates test system
- 2005: Teradyne to focus on test…sells Connection Systems
- 2005: Teradyne's FLEX Test Platform Expands in Japan; new small system form factor for next-generation device test introduced
- 2005: Teradyne and Its Employees Contribute $140,000 to South Asia Relief Efforts
- 2006: Teradyne receives Five Star Rating from VLSI Research
- 2006: Agere Systems honors Teradyne with 2006 Strategic Supplier Award
- 2006: Teradyne moves to North Reading, MA campus
- 2006: Teradyne delivers 1000th FLEX Test Platform System
- 2006: ATE Consumers rate Teradyne as ’10 BEST’ Supplier in VLSI Research 2006 Customer Survey
- 2007: Teradyne’s Chairman George Chamillard Retires; Patricia Wolpert Elected Successor
- 2007: Teradyne acquires enabling technology from MOSAID
- 2007: Texas Instruments recognizes Teradyne for excellence
- 2007: Customers select Teradyne as best equipment supplier in China
- 2007: Teradyne sells Broadband Test Division
Technical Milestones
1960s
- 1961: Teradyne introduces the first automatic diode tester, the D133.
- 1966: Teradyne introduces the first computer-controlled integrated-circuit test system, the J259.
1970s
- 1973: Teradyne introduces the first dedicated test system for memory devices, the J384.
- 1974: Teradyne introduces the world's first subscriber-line test system, 4TEL.
1980s
- 1980: Teradyne introduces the first combinational in-circuit/functional circuit board test system, the L200.
- 1983: The Megatest MegaOne is introduced with revolutionary tester-per-pin architecture.
- 1984: Teradyne Connection Systems develops High Density Plus board-to-backplane interconnect for high speed/high density commercial applications.
- 1987: Teradyne introduces the first PC-based circuit board tester to use spread-sheet programming, the Z1800-Series™ Manufacturing Process Test Platform.
- 1987: Teradyne introduces the first analog VLSI test system, the A500.
1990s
- 1991: Teradyne introduces VICTORY™, the first ATE-independent automatic program generation product for boundary scan test.
- 1992: Teradyne Connection Systems introduces Ultra-High Density (UHD) interconnect for advanced military/aerospace applications. UHD is qualified for use in space.
- 1995: Teradyne introduces the M900™, a complete digital test subsystem for circuit board and box-level testing in a single industry-standard VXI-D chassis.
- 1996: Teradyne Connection Systems builds the world's largest backplane, a 29" x 27" 34-layer impedance- controlled board with over 39,000 plated-through holes for connector attachment. The backplane is used in an advanced airborne radar system.
- 1996: Teradyne introduces Catalyst, the first System-on-a-Chip (SOC) test system.
- 1996: Teradyne introduces the Spectrum 8800-Series™ Manufacturing Test Platform, the first VXI-based in-circuit tester.
- 1997: Teradyne Connection Systems introduced the VHDM high-speed/ high-density board-to-backplane interconnect.
- 1997: Teradyne introduces the Spectrum 8800-series Manufacturing Test Platform, the first VXI-based in-circuit tester.
- 1997: Teradyne Introduces VX Test Simulation Software and the capability to develop and run test programs before first silicon.
- 1997: Teradyne Assembly Test introduces two Interscan™ automated optical inspection systems, a five-camera system for improved fault coverage and a single camera system for economical inspection.
- 1997: Teradyne Assembly Test introduces the Javelin 1004™, a flying probe in-circuit test system.
- 1998: Teradyne Connection Systems introduced the HSD (High-speed differential) version of VHDM (VHDM HSD).
- 1998: Teradyne introduces the Integra J750, a small footprint, low-cost, highly integrated test solution for high volume test of low-cost devices such as microcontrollers.
- 1998: Teradyne Introduces MicroWAVE6000™, RF/Microwave Instrumentation Suite, providing up to 6 GHz source, measure, and vector network analysis (VNA) for the Catalyst system.
- 1998: Teradyne Assembly Test introduces a 50 MHz channel card in the M9-Series™ of VXI Digital Test Instruments, the M920.
- 1998: Teradyne releases TestStudio™ ATE Operating Environment, stand-alone Web-based software for VXI instrumentation that integrates test development, documentation, debug, and execution.
- 1999: Teradyne Connection Systems introduced a new parallel board-to-board connector called NeXLev.
- 1999: Teradyne Assembly Test introduces the Spectrum 9100-Series™ Manufacturing Functional Test Platform, based on industry standards such as VXI plug&play and Windows NT.
- 1999: Teradyne Assembly Test announces the Spectrum 8950-Series™ ADSL Manufacturing Test Platform.
2000s
- 2000: Teradyne introduces Tiger, the first system to break the gigabit speed barrier delivering up to 1.25 Gbps full I/O data range, 1.6 Gbps differential
- 2000: Teradyne introduces the Optima 7300™ Post-Reflow Automated Optical Inspection (AOI) System, designed for inspecting visible component and solder joint defects at high-volume rates
- 2000: J973EP, First Structural to Functional test system with ability to shift in real time
- 2000: Teradyne introduces the Ai7-Series™ VXI Analog Test Instrument Subsystem, the first mixed signal subsystem on a card for high-density VXI C-sized functional test
- 2000: Teradyne introduces Celerity™ for mass qualification of copper loops for DSL service.
- 2000: Teradyne Japan Division introduces the IP750 Image Sensor Test System, the first system to adopt a complete parallel architecture, providing multi-site testing of CCD/CMOS image sensor devices
- 2000: Teradyne expands the Integra J750 family of Test Systems, introducing the J750k with full production test capability starting at $99,000
- 2001: Teradyne introduces the Optima 7200™ Post-Placement Automated Optical Inspection System
- 2001: Teradyne Introduces NetFlare™ end-to-end Internet test product to reduce broadband service call handling time, improving service provider's Quality of Service (QoS)
- 2001: Teradyne Japan Division expands the IP750 Image Sensor test system family with the IP750E to meet the low cost production test needs for CMOS camera modules
- 2002: Teradyne introduces the FLEX test system, providing production test flexibility for high volume, high mix IC test
- 2002: Teradyne introduces TestStation SE In-circuit tester featuring price and performance breakthroughs for volume manufacturing
- 2002: Teradyne introduces the industry's first synthetic bus test instrument, the Bi4-Series Bus Test Instrument
- 2002: Teradyne introduces High-Performance Support Packages, which include web-based support through eKnowledge.
- 2003: Teradyne introduces ATE industry's first same-cycle source synchronous pin electronics on the Tiger test system for functional at-speed testing to 3.2 Gbps
- 2004: FLEX Test Systems used for advanced FPGA device test
- 2004: Teradyne Introduces the IP750EP for High-Speed Test of Image Sensor Devices
- 2005: Teradyne Announces the Industry's Most Advanced Line of High Performance Digital Test Instruments
- 2005: UltraFLEX extends FLEX Platform family
- 2005: Teradyne Announces ATE Industry's First Universal Slot Open Architecture Solution
- 2006: Teradyne expands TestStation Scalability with UltraPin II Pin Board Family
- 2006: Teradyne Ships 150th Gen4 Microwave Option
- 2006: Teradyne’s microFLEX Selected by Infineon Technologies as Exclusive Test System for Automotive Power ICs
- 2006: Teradyne microFLEX Selected to Test DVB-H Chipsets; Enabling mobile TV for cellphones
- 2007: Teradyne introduces J750Ex, next generation low-cost tester
- 2007: Diagnostic Solutions launches 1-VIEW Ultra
