Teradyne - Semiconductor Test Division

Semiconductor Test is a lead-ing supplier of semiconductor test equipment for logic, RF, analog, power, mixed-signal, and memory technologies. We deliver test solutions to developers and manufacturers of a broad range of integrated circuits, packaged separately or integrated as System-On-a-Chip (SOC) or System-In-Package (SIP) devices. ICs tested by Teradyne are used in computing, communications, consumer, automotive, identification, and internet applications.

Flex Test Platform

 

FLEX Family Instrumentation

 

FLEX AC Instrumentation
Teradyne AC instrumentation provides source and capture test capability with arbitrary waveform generation (AWG) and digitizing to meet escalating test requirements for SiP, SoC and high performance devices with the lowest cost of test. Sources can create complex waveforms by combining simple waveforms together. Digitizers can selectively capture specific waveform elements to minimize the number of samples for processing and enhance test throughput. Banks of selectable filters, unique for specific requirements, deliver low noise and distortion, and extend overall instrument performance. Instruments take full advantage of the FLEX Architecture’s Sync-Link Technology for testing in multiple time domains, precise waveform phase matching, fast microcode-level instrument set-up and control, and full Background DSP with dedicated DSP computers. The combination of instrument capability and system architecture delivers the highest possible single site throughput and unsurpassed parallel test efficiency.

 

FLEX DC Instrumentation  
Teradyne DC instrumentation provides precision voltage/current (V/I) source and measure test capability for a wide variety of SoC devices. The integrated instruments source and measure voltage and current in four quadrant operation. Channels can be merged for higher current, and in some cases, sources can be pulsed to maximize current capability and limit device power dissipation. Instruments contain independent V/I source and measurement capability, differential voltmeters and time measurement capability. The V/I instrument architecture is optimized to be stable over a wide range of loads for both passive and reactive applications, and support a large variety of alarms to monitor for programming errors and marginal or defective devices. Instruments take full advantage of the FLEX Architecture’s Sync-Link Technology for fast, microcode level set-up and control.

 

FLEX DC Device Power Instrumentation
Teradyne Device Power Supply (DPS) instrumentation provides precision voltage source and current measurement test capability across a wide variety of devices. Instruments can force voltage and measure current in single or dual quadrant operation, and sources can be merged to reach higher current levels. The source architecture, with low output impedance, is optimized to support fast changes in current demand by providing high dynamic performance for fast settling time. The source also provides a large variety of alarms to monitor test execution by identifying possible programming errors and marginal or defective devices. The DPS Instruments take full advantage of the FLEX Architecture’s Sync-Link technology for fast microcode level set-up and control.

 

FLEX Digital Instrumentation
Teradyne digital instrumentation provides broad functionality and flexible test capability to meet the demands of evolving device performance and test methodologies at the lowest cost of test. Core data rates range to 1 GHz, with option instrumentation covering applications to tens of GHz. Digital instruments have dedicated hardware functionality for source and capture of digital data, including digital data representations of analog waveforms. Instruments can algorithmically calculate address and data for testing memories, eliminating the need to reload patterns into vector memory or recompile huge patterns when debugging, speeding test execution for higher throughput and simplifying test development. FLEX Family systems provide digital pattern data predetermined from design tools or created by the test engineer; Digital signal data for digital representations of analog waveforms using dedicated source and capture memories; SCAN data for “design for test” (DFT) applications; Memory pattern data algorithmically generated by hardware in real time to test embedded memory. Digital instruments can generate and receive these data types at multiple voltage levels, under different timing conditions, and be controlled on device pins that are input only, output only, I/O (input and output), single-ended or differential.

 

FLEX Microwave Instrumentation
Teradyne Microwave instrumentation tests a variety of microwave devices serving multiple global standards, including 802.11 WLAN, Bluetooth, GSM/GPRS/EDGE, CDMA,WCDMA/UMTS, WiMax, Zigbee, and others. A single instrument can test multiple RF devices in parallel, with typical configurations of dual, quad and octal site. Multiple source/measure channels cover frequencies from MHz to GHz with a full range of scalar and vector source and measurement capabilities. Users also have the ability to perform functional test via modulated signal generation and analysis for mainstream wireless protocol standards. FLEX Microwave instrumentation's superior accuracy and tester-to-tester repeatability reduces the prevalence of re-test processes in volume production. It simultaneously reduces rework costs while improving both device yields and quality, and assures consistent pass-fail performance across the test floor.