Teradyne - Semiconductor Test Division

Semiconductor Test is a lead-ing supplier of semiconductor test equipment for logic, RF, analog, power, mixed-signal, and memory technologies. We deliver test solutions to developers and manufacturers of a broad range of integrated circuits, packaged separately or integrated as System-On-a-Chip (SOC) or System-In-Package (SIP) devices. ICs tested by Teradyne are used in computing, communications, consumer, automotive, identification, and internet applications.

Flex Test Platform



FLEX power with a smaller footprint

Choose the microFLEX test system—with its zero-footprint “tester in a test head” design—when you need the full feature set of the FLEX test system in a smaller package. microFLEX is well-suited for consumer, wireless and automotive device test, and its small size makes it ideal for installations with limited floor space.

microFLEX highlights

  • Cost-efficient test up to 200 MHz. microFLEX is ideal for analog, digital and mixed-signal System-on-a-Chip (SoC) and System-in-Package (SiP) device testing applications.
  • A broad range of instruments. Choose from a suite of analog and digital instrument boards to configure your test solutions.
  • Instrument and DIB compatibility. Instruments and Device Interface Boards (DIBs) used with the FLEX test system are interchangeable with microFLEX.
  • Configuration flexibility. The system’s smaller air-cooled test head has 12 universal slots to accommodate a range of instruments, and can easily be reconfigured for different test strategies. An optional small-footprint 19” rack cabinet accommodates third-party instruments, such as those used in microwave test applications.

  • Small footprint saves floor space. System resources such as the power distribution unit, test computer and clock reference are located in the test head itself, eliminating the need for a separate mainframe cabinet.