Test Interface Products (DIB, HIB, PIB)

Get to market faster with TAG support
Teradyne's Device Interface Board (DIB), Handler Interface Board (HIB), and Probe Interface Board (PIB) solutions address the increasing complexity of devices and your need to reduce time to market. TAG, taking the lead in streamlining test operations, can help you get it right the first time.

Getting it right with TAG's Test interface solutions
Achieving optimal signal integrity is difficult as device speeds increase and more functionality is integrated on a single chip. Vital to the development process is the interface board design and fabrication. Both significantly impact the device program's introduction which makes multiple interface board revisions unacceptable in today's market. TAG, with its unmatched understanding of key requirements for interfacing devices to the Teradyne test platform, offers interface solutions for the Wafer Probe, Manual Device and Automated Handler Device tests.

Why Teradyne for Test Interface Products?

• Tester Knowledge – The Test Interface Product Team has designed the instrument signal delivery path for digital power, analog, AC and RF Instruments, and is a key contributor to the Tester DIB Design guidelines. This gives unmatched insight into the tester performance, allowing intelligent trade-offs to balance performance vs. cost for engineering or production design.
• Application Knowledge – TAG has the full system view. An integrated team with device applications knowledge and DIB design means it's not just a PCB design, but a test solution. Applications knowledge goes into the design up front, and is available during debug and correlation to shorten release to production.
• New Instrument Deployment – The Test Interface Products Team is the resource used by engineering to create the basic DIB design information and test fixtures, giving us unique knowledge of the performance envelope. We design DIBs for an instrument long before the instrument is deployed.
• Engineering Skills – The Test Interface Products Team is comprised of electrical engineers skilled in developing high-performance test solutions. This expertise is essential to the rapid assessment and design of the interface board that addresses critical signal path issues. The result is an increased probability that the board will work the first time, eliminating costly and time-consuming revisions.
• Worldwide Footprint – The Test Interface Products team has a design center where you are. No company has as many local offices and as many applications engineers as Teradyne. TAG Technical resources are worldwide to support production ramp and the offshoring efforts of our customers.
• Cradle to Grave Support – Teradyne provides repair and replacement services for all your test interface hardware. Using our proven Rapid Repair and Response centers, we stock replacement DIBs, minimizing downtime, and lowering your inventory expense.
• Access to buy and build processes of a $1 billion company means unmatched economies of scale. Leveraging the tester supply chain quality metrics and economics for DIB procurement means higher quality components, assemblers, and fabs, with lower costs to you.

Key Advantages of TAG's Test Interface Products

• Integrated applications and interface design mean avoiding costly delays to achieve first-pass success
• A wide range of versatile solutions for Wafer, Handler, and Manual test
• High-quality designs provide optimal signal integrity. Cradle-to-grave support minimizes downtime and lowers your maintenance expenses

Our Skills and Capabilities

More than 28 design engineers in four Design Centers worldwide give you same time zone, same language access to your design team. Each Design Center has uniform tools and libraries, and is staffed by degreed engineering leads.

Design Centers Agoura Hills, Calif., USA HsinChu, Taiwan Kumamoto, Japan Munich, Germany North Reading, Mass., USA Shanghai PRC
What We Do and What We Have Done Designed, layout, and built more than 400 FLEX Family DIBs, spanning production, engineering, and prototypes for PIBs, HIBs, Probecards, Calibration, Product Verification and Checker DIBs. We support all instrument types, including HSD, DCIO, SB6G, VSM, HexVS, DC30/75/90, BBAC, Gigadig, HDVS, TurboAC, RF, TurboAC, POOL 2, AWG6G, VHFAC.
Design for all types of devices in Teradyne's market space: CPU, mixed signal, RF, ADC/DAC, Memory, high speed, analog, digital, high current, low leakage, large component count, and so on. Designed signal delivery path for tester instruments (VSM, HexVS, DC30, BBAC). Work with Engineering on new instruments to create calibration, checker, and design verification boards. Use TDR, VNA, and LCR in characterizations to create tester DIB guidelines (3D CST, Ansoft 2D FLEX PDC, SPICE) Member of CAT Experience with Fine Pitch, HVDM
Our Product Portfolio
DIB Repair Services

 

 

 

 

 

 

 

 

Working with TAG is easy. The first step is to understand your requirements so we can provide a quote.

Typical lead times are 8 weeks ARO and receipt of required customer information and materials. Consult your TAG engineer for shorter lead-time requirements.

Contact us for more information on interface products. Whether you need an interface board or a completely integrated test cell, TAG has the expertise to deliver.

To learn more about TAG's customized engineering solutions, contact your local field support engineer or Sales representative.

We welcome your comments and questions about TAG.
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