TUG 2008 Best Paper Winners ASSEMBLY TEST Defense & Aerospace Kirk Douglass , U.S. Air Force/Hill AFB, USA “Di-Series Evaluation for Replacing an M9-Series Digital Test Instrument” SEMICONDUCTOR TEST Digital Tim Lyons, Teradyne, USA “The Testhead Applications Card (TAC) and a 12.8Gbps Custom Serial Driver Module with Wicked Good Jitter Injection" Mixed Signal Keith Lucy, Teradyne, USA "UltraFLEX HSD1000 Digital Signal Source and Capture (DSSC) Tips and Techniques" Power Management/Automotive Phillippe Cherbonnel, STMicroelectronics, France David Ducrocq, Teradyne, France “IG-XL Interaction Capabilities with Windows Applications: Development of IG-XL Characterization Add-In” RF Wireless Sergio Calais, E2V, France Francois Deun, Teradyne, France “Need 20GHz to Test on Tiger?" Test Infrastructure and Production George Tabone, STMicroelectronics, Malta “Device Recognition Using Artificial Neural Network Intelligence” If you would like a copy of the Best Papers and Presentations, you can download the papers from the eKnowledge website for both Assembly Test and Semiconductor Test. You must be a licensed user of Teradyne equipment or software in order to receive this material. ©Teradyne Inc. 1994-2008 All rights reserved. Terms of Use | Privacy Statement | Site Index | Contact Us | Feedback