TUG Information

Teradyne Users Group

About TUG

The Teradyne Users Group (TUG) Conference was first incorporated by Teradyne customers in 1983. Each year the Users Group Conference is held at rotating locations within the U.S. This conference consists of technical papers, panel and poster sessions, as well as tutorials that present the latest in test technology.

TUG is run by an annually elected steering committee of Teradyne customers, with Teradyne appointed delegates. Participation at TUG is restricted to licensed users of Teradyne products and those invited by the TUG Steering Committee.

Semiconductor Test addresses test issues related to developers and manufacturers of a broad range of integrated circuits, packaged separately or integrated as cells, SoC and SiP devices, and covering a broad range of applications, including computing, communications, consumer, automotive, identification, and the internet. Teradyne test systems covered include: FLEX Platform systems (FLEX™, microFLEX™, UltraFLEX™), Catalyst™, Tiger, J750, and IP750. TUG 2007 technical sessions are assembled in five technology and market segment groups. They are Digital, Mixed Signal, Power Management/Automotive, Production Integration & Hardware/Software Interface, and RF Wireless.

Assembly Test: Defense and Aerospace Test Solutions sessions are for user technicians and test engineers responsible for developing, architecting, or maintaining factory, depot, or intermediate (I-Level) functional board or box test program sets. This includes users of the Spectrum™ 9100 or L-Series Functional Test Systems, as well as users of M9-Series™ and Di-Series Digital Test Instruments, the Ai-7 Series™ Analog Test Instruments, the Bi4-Series™ Serial Bus Test Instruments, TestStudio™, TPS Converter Studio™, LASAR™, and VICTORY™.

Catalyst, FLEX, microFLEX, UltraFLEX, M9-Series, Spectrum, Ai7, Bi4, TestStudio, TPS Converter Studio, LASAR, and VICTORY are trademarks of Teradyne, Inc