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The Teradyne Users Group (TUG) Conference was first incorporated by
Teradyne customers in 1983. Each year the Users Group Conference is
held at rotating locations within the U.S. This conference consists
of technical papers, panel and poster sessions, as well as tutorials
that present the latest in test technology.
TUG is run by an annually
elected steering committee of Teradyne customers,
with Teradyne appointed delegates. Participation at TUG is restricted to licensed users of Teradyne products and those invited by the TUG Steering Committee.
 Semiconductor Test addresses test issues related to developers and manufacturers of a broad range of integrated circuits, packaged separately or integrated as cells, SoC and SiP devices, and covering a broad range of applications, including computing, communications, consumer, automotive, identification, and the internet. Teradyne test systems that are covered include Catalyst™, D750Ex, FLEX Platform systems (FLEX™, microFLEX™, UltraFLEX™), IP750Ex, J750Ex, J973, and Tiger and, with the acquisition of Nextest and Eagle Test Systems, the Magnum, Maverick, and ETS family of testers have been added. TUG 2011 technical sessions are assembled in five technology and market segment groups. They are Digital, Mixed Signal, Power Management/Automotive, RF Wireless, and Test Infrastructure and Production.
Assembly Test: Defense and Aerospace Test Solutions sessions are for user technicians and test engineers responsible for developing, architecting, or maintaining factory, depot, or intermediate (I-Level) functional board or box test program sets. This includes users of the Spectrum™ 9100 or L-Series Functional Test Systems, as well as users of M9-Series™ and Di-Series Digital Test Instruments, the Ai7 Series™ Analog Test Instruments, the Bi4-Series™ Serial Bus Test Instruments, TestStudio™, TPS Converter Studio™, LASAR™, and VICTORY™.
Catalyst, FLEX, microFLEX, UltraFLEX, M9-Series, Spectrum, Ai7, Bi4, TestStudio, TPS Converter Studio, LASAR, and VICTORY are trademarks of Teradyne, Inc.
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