Teradyne - Semiconductor Test Division

Semiconductor Test is a lead-
ing supplier of semiconductor test equipment for logic, RF, analog, power, mixed-signal, and memory technologies. We deliver test solutions to developers and manufacturers of a broad range of integrated circuits, packaged separately or integrated as System-On-a-Chip (SOC) or System-In-Package (SIP) devices. ICs tested by Teradyne are used in computing, communications, consumer, automotive, identification, and internet applications.

Product Integration

Prober Interfaces

The Prober Interfaces offered by the Production Integration group allow the Teradyne testers to dock to a variety of current model probers without any additional integration effort on behalf of the customer.

A standard Bottom Load (probe card changer ready) Prober Interface consists of:

  • 'L'-plate and spacers for hardware componets

  • Set of Teradyne Docking Grooves

  • Set of Teradyne Coarse Alignment Pins

  • Quick DIB Clamp Interface Plate

  • Signal Deliver Tower Flange

A Top Load (non probe card changer ready) version replaces the tower flange with a clamshell insert for loading the probe card. 

 

The Signal Delivery tower is purchased separately and is offered in many configurations, specified by the Signal Pin count, which is the total number of fully shielded pins available*:

  • 900, 1080, 1350, 1620, 2070 Signal Pin Standard Solutions

  • 360, 900, & 1620 Signal Pin Solutions with Increased Applications Space

Currently, Teradyne offers Prober Interfaces for the following models:

Electroglas 5|300, 4|200, 4080, 4090

Accretech/TSK UF200 AL/FL/S, UF300, UF3000 /Wide

TEL P8 XL/XLn/XLm, P12 XL/XLn/XLn+/Wide

*The signal towers utilize a 5 wire array design for maximum flexibility.  The total pin count is higher than listed, e.g. the 2070 signal pin tower has 4650 total pins.

For more information, please contact your local sales representative.