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  • Configurable Serial Bus Capability with Integrated Real-Time Processing

    HSSub 5050Best choice when current or future requirements include: 

    • Multiple concurrently operating buses to 3.125Gb/s
    • FPGA and processor configurability to support a wide range of lower and upper level protocols
    • High bandwidth, memory, and processing capacity coupled with predictable low latency interactions
    • Wired or optical I/O support
  • Technical Description
    • Up to 16 bidirectional serial ports provide for multiple concurrent serial buses, multi-lane buses, and wiring configuration flexibility
    • Combines low-level Tier 1 (I/O Bus Processing) and upper-level Tier 2 (Real-Time Computing) capabilities of the HSSub Three Tier Architecture in a single instrument
      • Reconfigurable Tier 1 implemented by a large Test Defined FPGA and Tier 2 by a dedicated processor and real-time operating system (RTOS)
      • Configured in seconds by HSSub Apps
    • HSSub Apps employ the HSSub TriFlex Infrastructure Software to provide application-specific instrument configurations
      • High-level TPS access on the Windows computer
      • Totally open access to the Test Defined FPGA and programs on the RT processor
      • HSSub App development, if required, is simplified by FPGA template code based on standard design patterns
      • HSSub Apps developed by Teradyne, end users, and third-parties
    • One instrument can support both copper cable I/O and Optical I/O (in conjunction with the HSSub-6065 Optical IO Expansion Instrument)
  • Key Attributes

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