Test Solution for Low Cost, High Efficiency Parallel Test


Teradyne’s J750 platform is the industry standard for cost-effective test of a broad set of diverse microcontroller, FPGA and digital audio/baseband devices. The system is widely available at more than 50 OSAT locations and is supported by a complete set of production interface solutions for wafer sort and final test.

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  • Applications

    Microcontroller

    FPGA

    Digital Audio / Baseband Device

    LCD Driver, Touchscreen Sensors and Touch Display Driver Integration (TDDI)

  • Advantages

    Teradyne packs power and performance into the compact, economical J750 family of semiconductor test systems.

    • Low capital cost
    • Easily upgradeable from current J750 systems to J750Ex-HD
    • “Zero footprint” design for minimum use of space on the manufacturing floor
    • IG-XL™ software for rapid program development that automatically scales to multisite, saving development time and cost
  • Configurations

    All J750 family systems are DIB compatible and use IG-XL software. Test programs for all J750 systems can be quickly migrated to a new system, with translation taking less than an hour for most programs.

    J750Ex

    • Up to 512 or 1024 multifunction pins
    • Data rate up to 200 MHz / 400 Mbps
    • Vector Memory depth up to 64M per pin with integrated SCAN

    J750Ex-HD

    • Up to 2048 multifunction pins
    • Data rate up to 400 MHz / 800 Mbps
    • Vector Memory depth up to 128M per pin

    J750-LitePoint

    • Available as an RF upgrade to all J750 models
    • Support for up to 32 ports
    • Scalable configurations for cellular and connectivity RF applications
    • Learn more about the J750-LitePoint

    J750 - LCD Driver Instrument Solution​​

  • System Options

    J750 has a complete suite of digital, DC and analog instrumentation to cover a broad range of consumer semiconductor test requirements and offer densities to deliver high site count testing.

    • DPS (Device Power Supply) for precision controlled device power
    • HDVIS (High Density VI Source) for higher site count and pattern control
    • MSO (Mixed Signal Option) for embedded analog, audio and mixed signal test
    • CTO (Converter Test Option) for testing embedded converters
    • APMU (Analog Pin Measurement Unit) for mixed signal test
    • RFID for testing embedded ID interfaces
    • MTO (Memory test option) for embedded memory test
    • DSSC (Digital Signal Source & Capture) behind each pin for memory, mixed signal and DFT
    • DSHRAM (Deep Scan History RAM)
    • HVD (High Voltage Digital)

    RF

  • Software

    IG-XL-245x100-TeradyneTeradyne’s award-winning IG-XL Software transforms test program development. Its powerful, yet easy-to-use, graphical environment lets engineers rapidly develop fully functional test programs, cutting program development and debugging time. Designed to address multisite complexity, IG-XL can convert single site test programs to multisite automatically, speeding time to market and reducing cost of test. With IG-XL, test engineers focus on actual testing, not writing code for the tester.

    Learn more about IG-XL Software