Teradyne - Semiconductor Test Division

Semiconductor Test is a lead-
ing supplier of semiconductor test equipment for logic, RF, analog, power, mixed-signal, and memory technologies. We deliver test solutions to developers and manufacturers of a broad range of integrated circuits, packaged separately or integrated as System-On-a-Chip (SOC) or System-In-Package (SIP) devices. ICs tested by Teradyne are used in computing, communications, consumer, automotive, identification, and internet applications.

 
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Check out the July cover story from Evaluation Engineering magazine "Multisite Test Strategy for SIP Mobile Technologies"


  

Written by Teradyne’s Jim McEleney, FLEX Platform Marketing Manager and Randy Kramer, Semiconductor Test Technical Marketing Manager.

This feature article describes the challenges in testing the latest System-in-Package devices. Combining digital processor, memory, analog components, converters, RF components, and often power management, the SiP requires highly integrated test capabilities to ensure the best test coverage and test economics.
Teradyne’s FLEX Test Platform offers the capabilities needed for economical, high-throughput SiP testing. It delivers a complete set of test resources - DC, AC, digital - to each DUT device core, with full synchronization and control of test instrumentation on a vector-by-vector basis in each device time domain. With the FLEX Platform, customers can optimize for performance, capacity, and capital cost to achieve lower cost-of-test.

Read the article on the web at http://www.evaluationengineering.com/archive/articles/0706/0706multisite_test.asp

For more information on Teradyne’s FLEX Platform go to
http://www.teradyne.com/flex/