Probe test has grown to over one-third of the overall test market, and new applications like System-in-Package (SiP) are driving the importance of finding "known-good-die" early in the test and manufacturing process. At the same time, the average device selling prices continue to decline putting more pressure on reducing the cost of test. FLEX at Wafer Probe brings multi-site efficiency to SOC testing and ultimately reducing the cost of test.

Teradyne's FLEX test platform is uniquely designed to deliver the lowest cost of test in the probe-test environment. "FLEX at Wafer Probe features the broadest device coverage of any product on the market today. The FLEX architecture, with its ability to approach device-limited test throughput (with test time limited only by the device under test) and pure parallel performance, can test a wider range of devices in less time than other probe test solutions," said Randy Kramer, Technical Marketing Manager at Teradyne.

FLEX at probe delivers the lowest cost of test across the full spectrum of devices.
No system delivers wider device coverage or higher site count at wafer probe than FLEX.

 

Harold LaBonte, Teradyne's Platform Marketing Manager, Wafer Probing, said, "At Wafer Probe, FLEX and the prober are in harmony. Wafer probers are indifferent to site count. Site count can be maximized for each new wafer limited only by the FLEX system and device pin counts, 2-3-4-5-8-9-16 up to 32 sites is possible. Customers can decide wafer by wafer the right site count for their test strategy. The system is flexible and our IG-XL software platform makes site count easily scalable."

Recent customer results for testing consumer baseband devices, showed FLEX achieving 95-98% multi site efficiency at 4 & 8 sites and demonstrating a throughput advantage over the competition by more than 30%. In some instances at wafer probe, FLEX will enjoy higher site counts than other systems. With a higher site count and throughput advantages, FLEX significantly reduces test costs for our wafer probe customers. Over 200 FLEX systems have been sold to more than 25 customers. "About one-third of our customers are using FLEX at Wafer Probe," says LaBonte.

FLEX at Wafer Probe offers all the advantages of the FLEX platform for probe test applications:

• Broadest device coverage at wafer probe of any system on the market, Full range of testing at probe from DFT and structural test to standard analog and mixed-signal to SOC
• Lowest cost to test – device limited test time, efficient multi-site up to 32 and site scalability combine to deliver lowest cost of test for every wafer.
• Fully integrated, high-volume SOC multi-site test cell available today for most Wafer probers 200MM and 300MM. Teradyne will work with you to ensure probe cards enable your desired site count.

Whatever devices you need to test at probe, FLEX provides the most cost-effective, solution available, for now and years from now. To learn more, contact your local Teradyne Sales Engineer.