Test Products
BOSTON--(BUSINESS WIRE)--April 14, 2003--Teradyne, Inc. announced that ChipPAC (Nasdaq: CHPC), one of the world's largest and most diversified providers of semiconductor assembly and test services, has purchased multiple Catalyst test systems for wireless device test. The order, valued at several million dollars, is for multiple test systems. Catalyst test systems are already being used to support ChipPAC's customer base in the wireless/RF consumer market. ChipPAC is using the test systems in their Malaysian test facility for final production test of IC products.
"ChipPAC has established itself as one of the world's leaders in providing RF test services," said J.B. Kim, VP of World Wide Test Operations for ChipPAC. "Teradyne's MicroWAVE6000(TM) instrumentation provides us with a clear advantage in the RF industry. In addition, Teradyne's demonstrated commitment to global customer service, which supports ChipPAC's production test centers in Malaysia, China, and Korea, was an important factor in our selection. They have proven to be a valuable partner in our success."
"Teradyne offers test service providers, like ChipPAC, a solution for RF testing that is unique in its combined ability to cover a wide range of devices," said David Derian, marketing manager for Wireless/RF at Teradyne. "Catalyst's DSP architecture enables multisite test that delivers industry leading production throughput. Teradyne's wireless test solution provides digital headroom for future RF device integration with the best test economics. The Catalyst series with MicroWAVE6000 covers not only the test requirements for WLAN and Bluetooth(TM) devices, but also mobile phone standards such as GSM, CDMA, and WCDMA."
About MicroWAVE6000
Teradyne's MicroWAVE6000 instrumentation suite provides a complete range of RF/microwave test capabilities required for current and future wireless devices and communications standards. MicroWAVE6000 includes full 6 GHz source, measure and vector network analysis (VNA) capability, complete 12-term error correction, and graphical-user interface (GUI) based test templates for programming ease-of-use plus options, including: microwave modulation, up to 16 RF pins, as well as options for noise figure, phase noise measurements and frequency hopping. Fully integrated within Teradyne's Catalyst and A5 test systems, MicroWAVE6000 is the only RF/microwave instrumentation available that also allows for complete system configuration flexibility for today's high-volume production environment. Catalyst and A5 systems can either be configured as focused RF test solutions, with ample room for further instrument expansion, or as complete wireless SOC test solutions by augmenting MicroWAVE6000 with the full complement of Teradyne's mixed-signal AC, DC, and digital instrumentation. In addition, MicroWAVE6000 instrumentation can be added easily to Catalyst and A5 installed systems.
About Catalyst
Catalyst dominates the SOC market with 1000 systems shipped. Test capabilities include full coverage for DSL, wireless/RF, networking, and power management applications. With more than 4,000 individual users worldwide, Catalyst's IMAGE(TM) programming system is the most widely used ATE software environment. Catalyst offers multi-site testing, providing the best test economics, and the most complete array of analog instrumentation for test coverage and production flexibility. When a mobile phone call is placed, or a PC, printer, scanner, pager, or DVD is utilized, Catalyst tested ICs make it happen and at the lowest cost of test.
About ChipPAC, Inc.
ChipPAC is a full-portfolio provider of semiconductor packaging design, assembly, test and distribution services. The company combines a history of innovation and service with more than a decade of experience satisfying some of the largest customers in the industry. With advanced process technology capabilities and a global manufacturing presence spanning Korea, China, Malaysia and the United States, ChipPAC has a reputation for providing dependable, high quality packaging solutions. For more information, visit the company's Web site at www.chippac.com.
About Teradyne
Teradyne (NYSE:TER) is the world's largest supplier of Automatic Test Equipment, and a leading supplier of interconnection systems. The company's products deliver competitive advantage to the world's leading semiconductor, electronics, automotive and network systems companies. In 2002, Teradyne had sales of $1.22 billion, and employed about 7000 people worldwide. For more information, visit www.teradyne.com.
IMAGE and MicroWAVE6000 are trademarks of Teradyne, Inc. Bluetooth is a trademark owned by the Bluetooth SIG, Inc. Third party marks and brands are property of their respective holders.
