BOSTON--(BUSINESS WIRE)--July 19, 2002--Teradyne announced the FLEX test system has been selected as the new tester platform for Microchip Technology Inc. Microchip will use the FLEX for testing a range of devices including the rfPIC(TM) series. The rfPIC microcontrollers integrate the power of Microchip's PICmicro(R) devices with UHF wireless communication capabilities for low power RF space-constrained applications. Microchip's selection of the FLEX was based on several criteria including the flexibility of the system, which enables further product line expansion into microcontrollers with wireless interfaces, high-speed microcontrollers and analog ICs.

"Microchip reviewed information from a total of eight (8) different RF tester suppliers and our analysis consisted of eleven (11) different categories with over 100 criteria items," said Dick Fisher, Director of Microchip's RF Product Group. "Each of the criteria was evaluated by a multi-divisional team who weighted and ranked them based on all of our needs and future requirements. Teradyne's FLEX scored the highest."

"For many years now, Teradyne has supported Microchip with the successful implementation of the Integra J750," said Ted Quinn, FLEX Marketing Manager. "We look forward to continuing our support of Microchip's technical advancements and product expansion with the FLEX. The Universal Slot architecture, wide range of instrumentation and IG-XL5 software of the FLEX will enable a high degree of flexibility to meet the new device technology test needs of Microchip."

About FLEX

Changing the way IC makers and subcontract test companies think about the mix of equipment they need on their test floors, FLEX is a new high-volume, high-mix semiconductor test system spanning multi-site DFT to standard analog to SOC test. The FLEX integrates self-contained SOC Tester-Per-Pin(TM) instruments in a Universal Slot architecture that allows users to easily match system configuration to changing production needs for a wide range of devices. The independent TimeTracks(TM) architecture provides multiple clocks and sequencers per DUT socket, increasing the number of separate time domains from a few to dozens. Multi-level IG-XL5 system software gives test engineering the ability to mix fully graphic template programming, high level test procedures, and low level precision control. Utilizing portable test IP, FLEX can quickly go from single-site to multi-site test for fast production volume ramps. To learn more about FLEX, visit www.teradyne.com/integraflex.

About Microchip Technology

Microchip Technology Inc. manufactures the popular PICmicro(R) field-programmable RISC microcontrollers, which serve 8- and 16-bit embedded control applications, and a broad spectrum of high-performance linear and mixed-signal, power management and thermal management devices. The Company also offers complementary microperipheral products including interface devices; microID(TM) RFID devices; serial EEPROMs; and the patented KEELOQ(R) security devices. This synergistic product portfolio targets thousands of applications and a growing demand for high-performance designs in the automotive, communications, computing, consumer and industrial control markets. The Company's quality systems are ISO 9001 (1994 version) and QS9000 (1998 version) certified. Microchip is headquartered in Chandler, Arizona with design facilities in Mountain View, California and Bangalore, India; semiconductor fabrication facilities in Tempe and Chandler, Arizona and Puyallup, Washington; and assembly and test operations near Bangkok, Thailand. Microchip employs approximately 2,950 people worldwide and has sales offices throughout Asia, Europe, Japan and the Americas. More information on the Company can be found at www.microchip.com.

About Teradyne

Teradyne (NYSE: TER) is the world's largest supplier of automatic test equipment and is also a leading supplier of high performance interconnection systems. Teradyne's test products are used by manufacturers of semiconductors, circuit assemblies, voice and broadband telephone networks. Teradyne's backplane assemblies and high-density connectors are used by manufacturers of communications and computing systems central to building networking infrastructure. The company had sales of $1.4 billion in 2001 and currently employs about 8000 people worldwide. For more information visit www.teradyne.com.

 

***

 

rfPIC is a trademark of Microchip Technology, Inc. PICmicro is a registered trademark of Microchip Technology, Inc. Time Tracks and SOC Tester Per Pin are trademarks of Teradyne.