Teradyne - Semiconductor Test Division

Semiconductor Test is a lead-ing supplier of semiconductor test equipment for logic, RF, analog, power, mixed-signal, and memory technologies. We deliver test solutions to developers and manufacturers of a broad range of integrated circuits, packaged separately or integrated as System-On-a-Chip (SOC) or System-In-Package (SIP) devices. ICs tested by Teradyne are used in computing, communications, consumer, automotive, identification, and internet applications.

FLEX News Archive

 

2002

Sept. 24, 2002
Toshiba Selects Teradyne's FLEX Test System; Toshiba to Use New Universal Slot Architecture for High-mix Consumer Device Test

July 19, 2002
Teradyne's FLEX Chosen as New Tester Platform for Microchip Technology; Universal Slot Architecture and IG-XL Software Enable Flexibility for Product Line Expansion

May 20, 2002
Teradyne Announces Open Architecture Initiative for the New FLEX Test System

May 1, 2002
Teradyne's New FLEX Test System Selected as Next Generation Platform; Universal Slot Architecture Enables Manufacturing Flexibility for Range of Devices

March 20, 2002
Teradyne Introduces FLEX; New Universal Slot Architecture Sets a New Standard for Semiconductor Test