BOSTON--(BUSINESS WIRE)--Jan. 21, 2004--Teradyne, Inc. (NYSE:TER) announced that Intersil Corporation (Nasdaq: ISIL) has purchased the FLEX test system for CD and DVD writable drive device test. In a competitive selection process, Intersil chose FLEX for the system's open architecture that enables the integration of customer-specified instrumentation. ChipPAC, Inc. (Nasdaq: CHPC), working in partnership with Intersil will be the first test subcontractor to deploy Teradyne's FLEX. To create a fully integrated and enhanced test solution, Intersil is utilizing the OpenFLEX architecture to integrate third party instrumentation. The selection was also based on the reduced cost of test Teradyne's FLEX system delivers through multi-site test.

"The open architecture of Teradyne's FLEX allowed us to plug-in a currently available instrument required for our test needs and advance to production in the shortest possible time," said Kevin Ellis, Intersil's Director of Product and Test Engineering. "As our test needs change, we are working closely with our outsourced test partner, ChipPAC, to deploy the new system in order to leverage its 'plug and play' architecture, which is designed to quickly and easily adapt to meet new test demands. FLEX's capability for multi-site test was crucial for reducing our test costs and meeting the ramp for our new products. The production flexibility combined with improved device test times and increased test sites provides us with the test and economic performance necessary in today's market."

"The successful collaboration between our test engineers and those of our customer, Intersil, and the test equipment provider, Teradyne, was essential to bring up this new platform solution on time with the performance benefits targeted. The successful outsourcing model that Intersil has adapted, which is the model being embraced by leading IDM and fabless companies, requires this type of close partnership," commented JB Kim, Vice President & General Manager, Test Business Development, ChipPAC. "We are pleased to be the first subcontractor to offer a turnkey business solution with this system."

"Teradyne's OpenFlex architecture meets customers' dynamic requirements by adjusting to the changing demands of semiconductor test," said Frank Westerhoff, Consumer Product Manager, Teradyne. "Manufacturers want factory floor flexibility to improve cost, productivity and cycle time - and that's what FLEX delivers. OpenFLEX enables our customers to quickly implement collaborative test solutions to enhance performance and economics for their specific applications. We look forward to working with Intersil and ChipPAC as they expand their use of FLEX to additional products."

FLEX

Breaking the cost of test barrier with multi-site test while meeting the demands of increasing device complexity for an expanding range of devices, FLEX advances multiple test technologies. OpenFLEX provides the commercial and technical infrastructure to facilitate the development and implementation of test solutions between Teradyne's customers and third party instrument suppliers. FLEX spans test requirements from conventional DFT and structural test to standard analog and mixed-signal to complex system-on-chip (SoC). An SoC tester-per-pin architecture delivers over 1000 digital channels, pattern controlled analog and high-efficiency concurrent testing. Device pins connect to any instrument, each with its own independent timing. Focused instruments enabled through OpenFLEX complement Teradyne's FLEX instrument suite enhancing the performance and economics of the FLEX system. To learn more about FLEX, visit http://www.teradyne.com/flex/.

About Intersil

Intersil Corporation is a leader in the design and manufacture of high performance analog semiconductors. The company's products address three of the industry's fastest growing markets - flat panel displays, optical storage (CD and DVD recordable) and power management. Intersil products include power management devices for battery management, hot-swap and hot-plug controllers, linear regulators, supervisory ICs, switching DC-DC regulators and power MOSFET drivers; optical storage laser diode drivers; DSL line drivers; video and high performance operational amplifiers; data converters; interface ICs; analog switches and multiplexers; crosspoint switches; voice-over-IP devices; and ICs for military, space and rad-hard applications. For more information about Intersil or to find out how to become a member of our winning team, visit the company's web site and career page at: www.intersil.com.

About ChipPAC, Inc.

ChipPAC is a full-portfolio provider of semiconductor packaging design, assembly, test and distribution services. The company combines a history of innovation and service with more than a decade of experience satisfying some of the largest customers in the industry. With advanced process technology capabilities and a global manufacturing presence spanning Korea, China, Malaysia and the United States, ChipPAC has a reputation for providing dependable, high quality packaging solutions. For more information, visit the company's Web site at www.chippac.com.

About Teradyne

Teradyne (NYSE:TER) is the world's largest supplier of Automatic Test Equipment, and a leading supplier of interconnection systems. The company's products deliver competitive advantage to the world's leading semiconductor, electronics, automotive and network systems companies. In 2002, Teradyne had sales of $1.22 billion, and currently employs about 6300 people worldwide. For more information, visit www.teradyne.com. Teradyne is a trademark of Teradyne, Inc. in the US and other countries.