FLEX meets high-volume consumer device demands with 8-in-parallel testing

 

BOSTON , MASSACHUSETTS – April 8, 2004 – Teradyne, Inc. (NYSE:TER) announced Korea-based SAMSUNG Electronics Co. Ltd has selected the FLEX test system for next generation multi-site package test. FLEX was selected, in a competitive evaluation process, after the system consistently demonstrated testing 8 devices in parallel with 95-98% multi-site efficiency. Teradyne’s FLEX also scored shorter single site test times than the competition. Multiple FLEX systems will be installed at SAMSUNG’s Onyang package test facilities to meet the test capacity demands of high-volume consumer baseband devices.

"The tester evaluation at SAMSUNG demonstrated that FLEX’s Sync-Link architecture and IG-XL software are clear differentiators when test capacity and device volume matter most," said Jin-soo Ko, Teradyne Applications Manager. "With FLEX’s Sync-Link architecture, all instruments are set up in parallel. At SAMSUNG and elsewhere we see that this pure parallel architecture makes test times faster and multi-site testing very efficient. The IG-XL software easily scales programs from single site to multi-site and makes FLEX highly adaptable in production."

"FLEX demonstrated 30% higher throughput than the competition on DVD and CD player devices for SAMSUNG," said Doug Elder, General Manager, Semiconductor Test Business Groups, Teradyne, "This significantly higher throughput was achieved by testing 8 devices in parallel. Manufacturers of high-volume consumer devices, like SAMSUNG, seek the lowest cost to test in the highest volume segment of the market, and multi-site test is essential to reduce costs and improve throughput. We look forward to providing SAMSUNG with the test capacity required for this price sensitive market."

FLEX

Breaking the cost of test barrier with high-efficiency multi-site test while meeting the demands of increasing complexity for an expanding range of devices, FLEX advances multiple test technologies. FLEX spans test requirements from conventional DFT and structural test to standard analog and mixed-signal to complex SoC. Its Tester-per-device-core architecture delivers a complete set of test resources to each device core, with instrument synchronization and control in device clock time on a vector-by-vector basis. The Universal Slot test head and high-density instrumentation allow easy reconfiguration to changing test needs, and the OpenFLEX open system architecture complements Teradyne's FLEX instrument suite, allowing the addition of focused instruments to further enhance system performance and test economics. To learn more about FLEX, visit http://www.teradyne.com/flex/.

 

About Teradyne

Teradyne (NYSE:TER) is a leading supplier of Automatic Test Equipment and interconnection systems. The company's products deliver competitive advantage to the world's leading semiconductor, electronics, automotive and network systems companies. In 2003, Teradyne had sales of $ 1.4 billion, and currently employs about 6100 people worldwide. For more information, visit www.teradyne.com. Teradyne is a trademark of Teradyne, Inc. in the US and other countries.