Teradyne - Semiconductor Test Division

Semiconductor Test is a lead-ing supplier of semiconductor test equipment for logic, RF, analog, power, mixed-signal, and memory technologies. We deliver test solutions to developers and manufacturers of a broad range of integrated circuits, packaged separately or integrated as System-On-a-Chip (SOC) or System-In-Package (SIP) devices. ICs tested by Teradyne are used in computing, communications, consumer, automotive, identification, and internet applications.

Teradyne Announces ATE Industry's First Universal Slot Open Architecture Solution

BOSTON--(BUSINESS WIRE)--July 7, 2005--Teradyne, Inc. (NYSE:TER) and Salland Engineering, of The Netherlands, have developed the automatic test equipment (ATE) industry's first fully-integrated, universal slot, open architecture test solution. Salland's High Density Parametric Measurement Unit (HDPMU) is a single board 192-channel instrument that installs directly into the Teradyne(R) FLEX™ system test head. Independent software drivers install directly into the FLEX IG-XL™ software system, making the HDPMU a fully integrated, "plug and play" installation. The HDPMU is now testing broadband and power management devices in production on FLEX systems at customers in Europe and Asia. The instrument was designed through the Teradyne OpenFLEX™ initiative that facilitates development of FLEX system instrumentation by customers and third-party suppliers.

"The development of the HDPMU by Salland Engineering demonstrates the success of the OpenFLEX initiative," said Paul Van Ulsen, CEO of Salland Engineering. "Salland was quickly able to develop hardware and software using the OpenFLEX guidelines to produce a fully-integrated instrument that customers can use to leverage their FLEX test platform for new applications. More importantly, customers are already using the HDPMU in production and achieving excellent results."

The HDPMU is a 192 channel high-density parametric measurement unit with multiple voltage and current ranges per channel, up to a maximum of 6.5 V and 32 mA. The Salland instrument supports channel merging for a maximum of 256 mA per channel and is certified through the OpenFLEX initiative. The instrument can be ordered through Salland Engineering or Teradyne. Service for the HDPMU is provided by the Teradyne Global Customer Service (GCS) organization.

"Salland took full advantage of the design rules and tools we've developed for creating hardware and software under the OpenFLEX initiative," said Sean Adam, Engineering Manager for the OpenFLEX initiative. "The HDPMU seamlessly integrates into the FLEX environment, enabling its designation as an OpenFLEX Certified™ product."

"With more than 300 FLEX platform systems installed at more than 40 customers worldwide, Teradyne has the largest installed base of open architecture systems in the ATE market," said Sten Peeters, Teradyne OpenFLEX Product Manager. "The increasing complexity of devices makes the availability of a broad range of test instrumentation critical to our customers' success. The OpenFLEX initiative gives them the means to get an expanded selection of instrumentation that meets their technology, time-to-market and cost-of-test needs."

About FLEX Test Platform and OpenFLEX

The Teradyne FLEX Test Platform™ advances multiple technologies in a test architecture designed for high-efficiency, multi-site test. The Platform offers multiple systems so customers can optimize performance, capacity and capital cost to achieve lower cost-of-test for test requirements spanning DFT and structural test to standard analog and mixed-signal to the latest high-integration System-on-a-Chip (SOC) and System-In-Package (SIP) devices. The OpenFLEX open architecture initiative leverages the open system architecture of the FLEX platform. Launched in May 2002, it is the first such initiative within the ATE industry. OpenFLEX provides the commercial and technical infrastructure to facilitate the development and implementation of collaborative test solutions with customers and third party instrument suppliers. These focused instruments complement the FLEX Platform's instrument suite, enabling customers to further enhance system performance and test economics. To learn more about the FLEX Platform, visit http://www.teradyne.com/flex/.

About Salland Engineering

Salland Engineering, headquartered in Zwolle, The Netherlands, is an international engineering company specializing in semiconductor test application services, semiconductor automation products and data analysis tools. Over the past 12 years, Salland Engineering has developed as a well-known worldwide partner, with companies in The Netherlands, Singapore and the United States. Salland currently collaborates with the largest electronics and test manufacturers in the world. . To learn more about Salland, visit www.salland.com.

About Teradyne

Teradyne (NYSE:TER) is a leading supplier of Automatic Test Equipment and interconnection systems. The company's products deliver competitive advantage to the world's leading semiconductor, electronics, automotive and network systems companies. In 2004, Teradyne had sales of $1.8 billion, and currently employs about 5900 people worldwide. For more information, visit www.teradyne.com. Teradyne(R) is a registered trademark of Teradyne, Inc. in the US and other countries. Teradyne, FLEX, OpenFLEX and OpenFLEX Certified are trademarks or registered trademarks of Teradyne, Inc.

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