BOSTON--(BUSINESS WIRE)--July 28, 2005--Teradyne (NYSE:TER) announced that UTAC (United Test and Assembly Center Ltd.), a leading independent provider of total semiconductor test and assembly solutions, has taken delivery of multiple Teradyne® FLEX™ test systems with a full range of Teradyne Gen4 Microwave test capability. The systems cover testing for the full spectrum of RF devices from discrete RF ICs to RF System-on-a-Chip applications (RF SOC). The FLEX systems are testing devices for multiple customers at UTAC's Singapore and Shanghai production facilities, significantly strengthening the company's test offering and market reach.

"The FLEX system and its Gen4 Microwave test capability enable us to address a wider range of highly-integrated applications for wireless products, including cellular transceivers, WLAN, Bluetooth and GPS," said CK Tan, UTAC's Group Vice President of Corporate Test and Development. "The rapid deployment of devices into production on our FLEX systems has already contributed to meeting critical production milestones for our customers."

"UTAC is a long-time Teradyne customer that has consistently valued test systems that enable its customers to confidently ramp their next-generation devices and achieve the lowest cost-of-test available," said David Trounson, General Manager, Teradyne Semiconductor Test Wireless Business Unit. "The FLEX architecture and Gen 4 Microwave capability will help UTAC meet the demanding test requirements of the latest wireless devices."

About the FLEX Platform

The Teradyne FLEX Test Platform advances multiple technologies in a test architecture designed for high-efficiency, multi-site test. The Platform offers multiple systems so customers can optimize for performance, capacity and capital cost to achieve lower cost-of-test. FLEX Platform systems span test requirements from DFT and structural test to standard analog and mixed-signal to the latest high-integration System-on-a-Chip (SOC) and System-In-Package (SIP) devices for consumer, automotive, mass storage, wireless, and data communications applications. The FLEX Platform architecture delivers instrument synchronization and control in device clock time on a vector-by-vector basis, even in multiple time domains. A Universal Slot test head design allows easy reconfiguration for changing test needs. The IG-XL™ software operating system provides fast program development, including instant conversion from single to multi-site test. And, the OpenFLEX™ open system architecture complements the FLEX Platform's broad set of high-density instrumentation, allowing focused instruments to be added and further enhance system performance and test economics. To learn more about the FLEX Platform, visit http://www.teradyne.com/flex/.

About UTAC

Established in 1997 and listed on the Main Board of the Singapore Exchange, UTAC is a leading independent provider of semiconductor assembly and testing services to its customers, which comprise Integrated Device Manufacturers ("IDMs"), fabless companies and wafer foundries. UTAC provides wafer probing and final testing services on a diverse selection of test platforms for a range of semiconductors including memory, logic, mixed-signal and radio-frequency ICs. Besides testing services, UTAC also provides assembly services for a broad range of leadframe and array packages.

Headquartered in Singapore where it houses its manufacturing, test engineering and package design facilities, UTAC has established a global network of sales offices in the United States, Europe, Japan, Korea and China. It also has wholly-owned subsidiaries in China and Taiwan to provide wafer probing and testing services. For more information, visit www.utacgroup.com.

About Teradyne

Teradyne (NYSE:TER) is a leading supplier of Automatic Test Equipment and interconnection systems. The company's products deliver competitive advantage to the world's leading semiconductor, electronics, automotive and network systems companies. In 2004, Teradyne had sales of $1.8 billion, and currently employs about 5,700 people worldwide. For more information, visit www.teradyne.com. Teradyne®, FLEX, IG-XL, and OpenFLEX are trademarks or registered trademarks of Teradyne, Inc.