BOSTON, MASSACHUSETTS - August 23, 2005 - Teradyne, Inc. (NYSE:TER) announced UTAC (United Test and Assembly Center, Ltd), a leading independent provider of total semiconductor test and assembly solutions, has deployed the Teradyne® UltraFLEX™ test system from the FLEX™ Test Platform and is currently running multiple systems in volume production. UltraFLEX systems were shipped to UTAC's facility in Singapore for testing mobile communications, broadband and network devices at both probe and final test. UTAC configured the systems with high performance serial bus test capability to over 6 Gbps (to cover the latest industry standards like PCI Express I and II and SATA) and broadband test instrumentation with bandwidth to 150 MHz and 140 dB dynamic range (to cover the most demanding applications, including HDTV and STB). UTAC has been a Teradyne customer since 1999 and currently has over 80 Teradyne test systems installed.

The UltraFLEX system incorporates all the features of the FLEX Platform architecture to achieve higher test efficiency and optimum test economics. UltraFLEX high-density instrumentation provides the digital speed, pin count, and precision measurement for multi-site testing of next-generation, high performance devices. The system's low-jitter design reduces guard-band requirements, which means customers can achieve higher yields. Better noise performance means fewer samples are needed during testing, resulting in higher throughput.

"The Teradyne FLEX Platform provides a cost competitive testing edge for the broadband communication market that UTAC is serving," said CK Tan, Group Vice President of Corporate Test Development, UTAC. "With our base of FLEX Platform systems, we now have the unique capability to support customers in every phase of the semiconductor SOC life cycle, from engineering development to volume production for datacom, broadband, graphics, and computing devices."

"The FLEX Platform clearly has made an impact within the semiconductor industry and, in particular, with test and assembly subcontractors who value the platform's quick implementation into production," said George Rose, General Manager, Teradyne Semiconductor Test Broadband Business Unit. "UTAC is one of the leading test and assembly subcontractors, responsible for testing some of the industry's most advanced SOC devices. Their UltraFLEX systems provide the performance and economics to meet production test requirements for high performance technologies that demand precision test solutions and low cost-of-test."

 

About the FLEX Platform
Teradyne’s FLEX Test Platform advances multiple technologies in a test architecture designed for high-efficiency, multi-site test. The Platform offers multiple systems so customers can optimize for performance, capacity and capital cost to achieve lower cost-of-test. FLEX Platform systems span test requirements from DFT and structural test to standard analog and mixed-signal to the latest high-integration System-on-a-Chip (SOC) and System-In-Package (SIP) devices for consumer, automotive, mass storage, wireless, and data communications applications. The FLEX Platform architecture delivers instrument synchronization and control in device clock time on a vector-by-vector basis, even in multiple time domains. A Universal Slot test head design allows easy reconfiguration for changing test needs. The IG-XL™ software operating system provides fast program development, including instant conversion from single to multi-site test. And, the OpenFLEX™ open system architecture complements the FLEX Platform’s broad set of high-density instrumentation, allowing focused instruments to be added and further enhance system performance and test economics. To learn more about the FLEX Test Platform, visit http://www.teradyne.com/flex/.

 

About United Test and Assembly Center, Ltd (UTAC)
Established in 1997 and listed on the Main Board of the Singapore Exchange, UTAC is a leading independent provider of semiconductor assembly and testing services to its customers, which comprise Integrated Device Manufacturers ("IDMs"), fabless companies and wafer foundries. UTAC provides wafer probing and final testing services on a diverse selection of test platforms for a range of semiconductors including memory, logic, mixed-signal and radio-frequency ICs. Besides testing services, UTAC also provides assembly services for a broad range of leadframe and array packages.

Headquartered in Singapore where it houses its manufacturing, test engineering and package design facilities, UTAC has established a global network of sales offices in the United States, Europe, Japan, Korea and China. It also has wholly-owned subsidiaries in China and Taiwan to provide wafer probing and testing services. For more information, visit www.utacgroup.com.

 

About Teradyne
Teradyne (NYSE:TER) is a leading supplier of Automatic Test Equipment and interconnection systems. The company’s products deliver competitive advantage to the worlds leading semiconductor, electronics, automotive and network systems companies. In 2004, Teradyne had sales of $1.8 billion, and currently employs about 5700 people worldwide. For more information, visit www.teradyne.com. Teradyne® is a registered trademark of Teradyne, Inc. in the US and other countries. All product names are trademarks or registered trademarks of Teradyne, Inc. (including its subsidiaries) or their respective owners.

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