Teradyne - Semiconductor Test Division

Semiconductor Test is a lead-ing supplier of semiconductor test equipment for logic, RF, analog, power, mixed-signal, and memory technologies. We deliver test solutions to developers and manufacturers of a broad range of integrated circuits, packaged separately or integrated as System-On-a-Chip (SOC) or System-In-Package (SIP) devices. ICs tested by Teradyne are used in computing, communications, consumer, automotive, identification, and internet applications.

Teradyne UltraFLEX Selected for Next-Generation

Video Graphics Device Test by Micronas

BOSTON, MASSACHUSETTS - September 20, 2005 - Teradyne, Inc. (NYSE:TER) announced Micronas, a German-based leader in integrated circuits (IC) and sensors for consumer and automotive electronics, has purchased multiple Teradyne(R) UltraFLEX(TM) test systems. The systems will be used in the engineering and production test of next-generation video graphics controllers used in LCD and HDTV applications. In a competitive selection process, Micronas chose the UltraFLEX system for its high-efficiency parallel test architecture, over 6 Gbps serial bus test capability, and the TurboAC(TM) broadband test instrument's industry-leading 140 dB dynamic range. Micronas is a longstanding European customer and currently has over 50 Teradyne test systems installed in production.

The Teradyne UltraFLEX test system is optimized to meet the next-generation device test requirements of mass storage, broadband, base band, data communications and computing applications. It incorporates all the features of the FLEX(TM) architecture to achieve optimum test economics. Architecture features like Sync-Link(TM) synchronization, for complete parallel control of instrumentation in multiple time domains, and Background DSP(TM) processing, with no test time penalties for data analysis, streamline multi-site test in production.

"We selected the UltraFLEX system because of its superior technical System-on-a-Chip (SOC) test capability," said Mr. Hartmut Delong, Senior Manager Test Development at Micronas. "Micronas develops state-of-the-art, industry-leading technologies to support the latest generations of high definition displays like next-generation LCDs and plasma panels. The UltraFLEX systems will be used for engineering and production testing of our latest, highly sophisticated video graphics controller and best-of-breed single-chip TV devices."

"Teradyne has proven their ability to design and deliver systems for the lowest cost of test," said Mr. Wilfried Lowinski, Vice President BE Operations, Micronas. "Our evaluation of the next generation test systems showed that the UltraFLEX system will continue this Teradyne strength. For production test, this and superior support are mandatory."

"Micronas is a market leader in highly integrated, next-generation digital TV devices that require the full breadth of the digital and analog performance that the UltraFLEX system delivers," said Brad Harkavy, Broadband Product Manager, Teradyne. "The FLEX Platform architecture is unique in its ability to deliver the broad digital test capability required for emerging high-speed serial bus standards and test across a broad analog spectrum, while achieving the low cost-of-test that is fundamental for the highly competitive HD TV and set top box market."

 

About the FLEX Platform
Teradyne’s FLEX Test Platform advances multiple technologies in a test architecture designed for high-efficiency, multi-site test. The Platform offers multiple systems so customers can optimize for performance, capacity and capital cost to achieve lower cost-of-test. FLEX Platform systems span test requirements from DFT and structural test to standard analog and mixed-signal to the latest high-integration System-on-a-Chip (SOC) and System-In-Package (SIP) devices for consumer, automotive, mass storage, wireless, and data communications applications. The FLEX Platform architecture delivers instrument synchronization and control in device clock time on a vector-by-vector basis, even in multiple time domains. A Universal Slot test head design allows easy reconfiguration for changing test needs. The IG-XL™ software operating system provides fast program development, including instant conversion from single to multi-site test. And, the OpenFLEX™ open system architecture complements the FLEX Platform’s broad set of high-density instrumentation, allowing focused instruments to be added and further enhance system performance and test economics. To learn more about the FLEX Test Platform, visit http://www.teradyne.com/flex/.

 

About Micronas
Micronas (SWX Swiss Exchange: MASN, Frankfurt: MNSN, Prime Standard Segment, TecDAX), a semiconductor designer and manufacturer with worldwide operations, is a leading supplier of cutting-edge IC and sensor system solutions for consumer and automotive electronics. As a market leader in innovative, global TV system solutions, Micronas leverages its expertise into new markets emerging through the digitization of audio and video content. Micronas serves all major consumer brands worldwide, many of them in continuous partnerships seeking joint success. While the holding is headquartered in Zurich (Switzerland), operational headquarters are based in Freiburg (Germany). Currently, the Micronas Group employs about 1900 people. In 2004, it generated CHF 963 million (Swiss Franc) in sales. For more information on Micronas and its products, please visit www.micronas.com.

 

About Teradyne
Teradyne (NYSE:TER) is a leading supplier of Automatic Test Equipment and interconnection systems. The company’s products deliver competitive advantage to the worlds leading semiconductor, electronics, automotive and network systems companies. In 2004, Teradyne had sales of $1.8 billion, and currently employs about 5700 people worldwide. For more information, visit www.teradyne.com. Teradyne® is a registered trademark of Teradyne, Inc. in the US and other countries. All product names are trademarks or registered trademarks of Teradyne, Inc. (including its subsidiaries) or their respective owners.

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