Teradyne - Semiconductor Test Division

Semiconductor Test is a lead-ing supplier of semiconductor test equipment for logic, RF, analog, power, mixed-signal, and memory technologies. We deliver test solutions to developers and manufacturers of a broad range of integrated circuits, packaged separately or integrated as System-On-a-Chip (SOC) or System-In-Package (SIP) devices. ICs tested by Teradyne are used in computing, communications, consumer, automotive, identification, and internet applications.

FLEX News Archive

2007 | 2006 | 2005 | 2004 | 2003 | 2002

 

2005

October 13, 2005
Atheros Purchases Teradyne FLEX System for Quad-Site
Production Device Test
Teradyne’s Gen4 Microwave tests single-chip Personal Handyphone System device

September 20, 2005
Teradyne UltraFLEX Selected for Next-Generation
Video Graphics Device Test by Micronas

August 23, 2005
UTAC Running Volume Device Test Production on Teradyne UltraFLEX
High performance test system extends FLEX Platform family

August 9, 2005
AMI Semiconductor Selects Teradyne FLEX Test Platform
Global mixed-signal device manufacturer purchases microFLEX systems for development and production test

July 28, 2005
UTAC Strengthens Wireless Test Capability with Teradyne FLEX for Microwave Test

July 7, 2005
Teradyne Announces ATE Industry's First Universal Slot Open Architecture Solution

June 2, 2005
MediaTek Expands Use of Teradyne's FLEX Platform for Next-Generation Test; Subcontractors Purchase Multiple FLEX Systems

April 14, 2005
CSR Purchases Multiple Teradyne FLEX Systems for Wireless Device Test

February 23, 2005
Teradyne's FLEX Test Platform Expands in Japan; New Small System Form Factor for Next-Generation Device Test Introduced

February 23, 2005
Teradyne Hosts Next-Generation SOC Testing Event; Japanese Electronics Industry Leaders Share Insights