Test Products
The UltraFLEX test system is optimized to meet next-generation device test requirements while incorporating FLEX(TM) architecture features like the Sync-Link(TM) synchronization technology for complete parallel control of instrumentation in multiple time domains, and Background DSP(TM) processing that eliminates test time penalties for data analysis. The FLEX architecture provides streamlined multi-site test in production so customers can achieve optimum test economics.
"The UltraFLEX test system is a perfect match for SMIC's leading device technologies," said SI Wei, Vice President, Teradyne Semiconductor Test Field Operations, Greater China Region. "The system is designed for high performance and extremely broad coverage provided by instruments such as the TurboAC(TM) Broadband AC Instrument. UltraFLEX delivers the flexibility and time to market features that integrated circuit manufacturers require to be competitive and achieve great test performance. Our China-based customer support team looks forward to continue working with SMIC as UltraFLEX is deployed to test their next-generation of advanced devices."
About FLEX
The Teradyne FLEX Test Platform advances test technologies in a test architecture designed for high-efficiency, multi-site test. The Platform offers multiple systems so customers can optimize for performance, capacity and capital cost to achieve lower cost-of-test. FLEX Platform systems span test requirements from DFT and structural test to standard analog and mixed-signal to the latest high-integration System-on-a-Chip (SoC) and System-In-Package (SiP) devices for consumer, automotive, mass storage, wireless, and data communications applications. The FLEX Platform architecture delivers instrument synchronization and control in device clock time on a vector-by-vector basis, even in multiple time domains. A Universal Slot test head design allows easy reconfiguration for changing test needs. The IG-XL(TM) software operating system provides fast program development, including instant conversion from single to multi-site test. And, the OpenFLEX(TM) open system architecture complements the FLEX Platform's broad set of high-density instrumentation, allowing focused instruments to be added and further enhance system performance and test economics. To learn more about the FLEX Platform, visit http://www.teradyne.com/flex/.
About SMIC
SMIC, headquartered in Shanghai, China, is an international company and one of the leading semiconductor foundries in the world, providing integrated circuit (IC) manufacturing at 0.35um to 90nm and finer line technologies to customers worldwide. Established in 2000, SMIC has four 8-inch wafer fabrication facilities in volume production in Shanghai and Tianjin. In the first quarter of 2005, SMIC commenced commercial production at its 12-inch wafer fabrication facility in Beijing, the first 12-inch fab in China.
About Teradyne
Teradyne (NYSE:TER) is a leading supplier of Automatic Test Equipment. The company's products deliver competitive advantage to the world's leading electronics companies. In 2005, Teradyne had sales of $1.08 billion, and currently employs about 4,000 people worldwide. For more information, visit www.teradyne.com. Teradyne(R), UltraFLEX, FLEX, Sync-Link, Background DSP, TurboAC, IG-XL, and OpenFLEX are trademarks or registered trademarks of Teradyne, Inc. in the US and other countries.
