Test Products
"The combination of Teradyne's customer support and test solutions addresses the test needs of our customers and enables ASAT to more efficiently utilize Teradyne test capacity," said John Ritchie, Senior Director of Test Operations and Engineering of ASAT. "By adopting the FLEX Platform for next generation device test, we will also be able to cover a broader range of customer's devices."
"ASAT has recognized the ability of the FLEX and J750 test systems to serve a wide, diversified range of customers as well as provide the highest return on their capital expenditures," said Dan Hamling, Fabless-Subcon Business Manager, Semiconductor Test Division, Teradyne. "This investment in Teradyne systems allows ASAT to reinforce their established leadership in mixed-signal test and strengthen their alignment to the test needs of the high-growth consumer semiconductor market in China."
About the FLEX Platform
The Teradyne FLEX Test Platform advances test technologies in a test architecture designed for high-efficiency, multi-site test. The Platform offers multiple systems so customers can optimize for performance, capacity and capital cost to achieve lower cost-of-test. FLEX Platform systems span test requirements from DFT and structural test to standard analog and mixed-signal to the latest high-integration System-on-a-Chip (SoC) and System-In-Package (SiP) devices for consumer, automotive, mass storage, wireless, and data communications applications. The FLEX Platform architecture delivers instrument synchronization and control in device clock time on a vector-by-vector basis, even in multiple time domains. A Universal Slot test head design allows easy reconfiguration for changing test needs. The IG-XL(TM) software operating system provides fast program development, including instant conversion from single to multi-site test. And, the OpenFLEX(TM) open system architecture complements the FLEX Platform's broad set of high-density instrumentation, allowing focused instruments to be added and further enhance system performance and test economics. To learn more about the FLEX Platform, visit http://www.teradyne.com/flex/.
About ASAT Holdings Limited
ASAT Holdings Limited is a global provider of semiconductor package design, assembly and test services. With over 15 years of experience, the company offers a definitive selection of semiconductor packages and world-class manufacturing lines. ASAT's advanced package portfolio includes standard and high thermal performance ball grid arrays, leadless plastic chip carriers, thin array plastic packages, system-in-package and flip chip. ASAT was the first company to develop moisture sensitive level one capability on standard leaded products. Today the company has operations in the United States, Asia and Europe. ASAT, Inc. is a wholly owned subsidiary of ASAT Holdings Limited and the exclusive representative of ASAT for services in North America. For more information visit www.asat.com.
About Teradyne
Teradyne (NYSE:TER) is a leading supplier of Automatic Test Equipment used to test complex electronics used in the consumer electronics, automotive, computing, telecommunications, and aerospace and defense industries. In 2005, Teradyne had sales of $1.08 billion, and currently employs about 4,000 people worldwide. For more information, visit www.teradyne.com. Teradyne(R), FLEX, microFLEX, IG-XL, and OpenFLEX are trademarks or registered trademarks of Teradyne, Inc. in the US and other countries.
