NORTH READING, Mass.--(BUSINESS WIRE)--Teradyne, Inc. (NYSE: TER) announces its sponsorship of the 2006 FSA Awards Dinner Celebration to be held on Thursday, December 7, 2006 at the Santa Clara Convention Center in Santa Clara, California. Teradyne, which currently has over 2,300 test systems installed at semiconductor subcontractors throughout the world, is sponsoring this annual event that recognizes fabless companies who have demonstrated excellence through their success, vision, strategy and future opportunity in the semiconductor industry.

"Teradyne has been an active member of FSA since 1995," said Vivian Pangburn, vice president, global marketing and membership at FSA. "Test solutions continue to be an area of vital importance to fabless companies. As a major provider in the subcontractor supply chain, we appreciate Teradyne's involvement in FSA and their support of the Awards Dinner Celebration, which recognizes excellence in the semiconductor industry."

"FSA plays an important role in keeping members connected to the latest technologies and trends in the fabless semiconductor community,” said Mark Jagiela, President, Semiconductor Test Division, Teradyne. “Teradyne serves countless IDMs, fabless and subcontract manufacturers. Our FLEX™ Platform is designed to meet the integrated technologies, multisite economics and accelerated time-to-market demanded by the fabless industry. As a market leader in providing test solutions to fabless and subcon companies, Teradyne is pleased to continue our support of FSA and sponsor the 2006 FSA Awards Dinner Celebration.”

The FLEX Test Platform offers a broad range of single board, high-performance, high-density analog (AC and DC) and digital instruments that replicate the device operating environment for test. The range of instrumentation lets users apply the best test strategy for high performance digital or high precision analog at package or probe.

About the FLEX Test Platform

The Teradyne FLEX Test Platform advances test technologies in an architecture designed for high-efficiency, multi-site test. The Platform offers multiple systems so customers can optimize for performance, capacity and capital cost to achieve lower cost-of-test. FLEX Platform systems span test requirements from (SOC) and System-In-Package (SIP) devices for consumer, automotive, mass storage, wireless, and data communications applications. The FLEX Platform architecture delivers instrument synchronization and control in device clock time on a vector-by-vector basis, even in multiple time domains. A Universal Slot test head design allows easy reconfiguration for changing test needs. The IG-XL™ software operating system provides fast program development, including instant conversion from single to multisite test. And, the OpenFLEX™ open system architecture complements the FLEX Platform’s broad set of high-density instrumentation, allowing focused instruments to be added and further enhance system performance and test economics. To learn more about the FLEX Platform, visit http://www.teradyne.com/flex/.

About FSA

FSA is the voice of the global fabless business model. Incorporated in 1994, FSA positively impacts the growth and return on invested capital of this business model to enhance the environment for innovation. It provides a platform for meaningful global collaboration between fabless companies and their partners; identifies and articulates opportunities and challenges to enable solutions; and provides research, resources, publications and survey information. Members include fabless companies and their supply chain and service partners, representing more than 21 countries across the globe. www.fsa.org.

About Teradyne

Teradyne (NYSE:TER) is a leading supplier of Automatic Test Equipment used to test complex electronics used in the consumer electronics, automotive, computing, telecommunications, and aerospace and defense industries. In 2005, Teradyne had sales of $1.08 billion, and currently employs about 3,900 people worldwide. For more information, visit www.teradyne.com.

Teradyne(R), FLEX, IG-XL, and OpenFLEX are trademarks or registered trademarks of Teradyne, Inc. in the US and other countries.