TOKYO--(BUSINESS WIRE)--Feb. 23, 2005--Teradyne, Inc. (NYSE:TER) hosted an event in Tokyo, Japan with distinguished speakers sharing their perspectives on the new era of Japan's semiconductor market. Speakers at the event included: Dr. Junichi Nishizawa, President, Iwate University; Dr. Tsugio Makimoto, Corporate Advisor, Sony Corporation; and Mark Jagiela, President, Semiconductor Test Division, Teradyne. Over 50 Executives and Managers from Japan's semiconductor companies attended the event at the Hotel Okura.

Dr. Nishizawa presented his views on the latest challenge in the Integrated Circuit (IC) revolution that the Japanese semiconductor industry has helped shape - a new generation of high-speed devices and applications approaching Terahertz speeds. Dr. Makimoto examined the vitalization of digital consumer products, the "digital boom" that's supported by the innovation of semiconductor technologies. The evening concluded with Teradyne's Semiconductor Test Division, President, Mark Jagiela addressing the test challenges these new technologies create and presenting Teradyne's high performance FLEX™ Test architecture in a new small system form factor, the microFLEX™.

"Teradyne is pleased to organize and participate in today's event," said Mark Jagiela, President, Semiconductor Test Division, Teradyne. "Bringing innovative technology products to cost sensitive markets has been a strength of the Japanese electronics industry and Teradyne has been proud to, over the years, enable those products through innovations in test. Today, we've introduced our latest innovation, the microFLEX, here in Japan."

About FLEX

Breaking the cost of test barrier with high-efficiency pure parallel multi-site test while meeting the demands of increasing complexity for an expanding range of devices, FLEX advances multiple test technologies. Its Tester-per-Device-Core™ architecture delivers a complete set of test resources to each device core, with instrument synchronization and control enabled by Sync-Link(TM) in the device clock time on a vector-by-vector basis. The Universal Slot test head and high-density instrumentation allow easy reconfiguration to changing test needs, and the OpenFLEX open system architecture complements Teradyne's FLEX instrument suite, allowing the addition of focused instruments to further enhance system performance and test economics. To learn more about FLEX, visit http://www.teradyne.com/flex/.

About Teradyne

Teradyne (NYSE:TER) is a leading supplier of Automatic Test Equipment and interconnection systems. The company's products deliver competitive advantage to the world's leading semiconductor, electronics, automotive and network systems companies. In 2004, Teradyne had sales of $1.8 billion, and currently employs about 5900 people worldwide. For more information, visit www.teradyne.com. Teradyne(R) is a registered trademark of Teradyne, Inc. in the US and other countries. All product names are trademarks or registered trademarks of Teradyne, Inc. (including its subsidiaries) or their respective owners.