Teradyne - Semiconductor Test Division

Semiconductor Test is a lead-ing supplier of semiconductor test equipment for logic, RF, analog, power, mixed-signal, and memory technologies. We deliver test solutions to developers and manufacturers of a broad range of integrated circuits, packaged separately or integrated as System-On-a-Chip (SOC) or System-In-Package (SIP) devices. ICs tested by Teradyne are used in computing, communications, consumer, automotive, identification, and internet applications.

National IC Design Industrialization Base, Hangzhou
Purchases the Teradyne J750


SHANGHAI, China – September 26, 2006 – Teradyne, Inc. (NYSE:TER) announced the National IC Design Industrialization Base, Hangzhou (HICC) has purchased the J750 test system to meet the device test demands of local IC design houses in the ZheJiang Province. Selection was based on Teradyne’s large and well established installed base of test systems that enables IC design houses to speed the load time of high volume production in local or overseas testing and packaging facilities. Strong global customer service and easy-to-learn software were also key elements in the selection of the J750.

“The Teradyne(R) J750 is the perfect fit for meeting local IC design house test demands,” said Mr. Qi Ma, Senior Vice President, HICC. “The IG-XL(TM) software environment on the J750 is a common software environment with the Teradyne FLEX(TM) Test Platform. This software commonality enables local design houses to meet current demand and have a robust roadmap of future high end product testing. High praise of the J750 by local full-scale IC design houses also confirmed our choice to purchase the J750.”

“HICC is located in Hangzhou, the capital of ZheJiang Province. The geographical location is advantageous for HICC to best serve the IC design houses in the region,” said SI Wei, Vice President, Semiconductor Test Field Operations, Greater China Region, Teradyne. “Their central location combined with the high volume production capability of the J750 is a powerful combination for their customers. We are very pleased to serve HICC as well as China’s IC design houses.”

About the J750
The Teradyne J750 high-throughput parallel test capability provides as high as 95% device test efficiency. The zero footprint system delivers up to 1,024 I/O channels contained in a test head, and offers a suite of options, including the Converter Test Option, Memory Test Option, Redundancy Analysis, and Mixed Signal Option, that broaden the range of testing capabilities. The system also features IG-XL test software that combines the power and performance of the latest PC technology and Windows NT operating system with the familiarity of standard Windows productivity tools, such as Microsoft Excel and Visual Basic. The J750’s small footprint and high parallel test throughput provide the most economical approach to testing complex VLSI devices with embedded memory and analog cells.

About FLEX
The Teradyne FLEX Test Platform advances test technologies in a test architecture designed for high-efficiency, multi-site test. The Platform offers multiple systems so customers can optimize for performance, capacity and capital cost to achieve lower cost-of-test. FLEX Platform systems span test requirements from DFT and structural test to standard analog and mixed-signal to the latest high-integration System-on-a-Chip (SoC) and System-In-Package (SiP) devices for consumer, automotive, mass storage, wireless, and data communications applications. The FLEX Platform architecture delivers instrument synchronization and control in device clock time on a vector-by-vector basis, even in multiple time domains. A Universal Slot test head design allows easy reconfiguration for changing test needs. The IG-XL software operating system provides fast program development, including instant conversion from single to multi-site test. And, the OpenFLEX(TM) open system architecture complements the FLEX Platform’s broad set of high-density instrumentation, allowing focused instruments to be added and further enhance system performance and test economics. To learn more about the FLEX Platform, visit http://www.teradyne.com/flex/.

About National IC Design Industrialization Base HICC
Approved by China’s Ministry of Science and Technology, National IC Design Industrialization Base Hangzhou was set up on December 7, 2001 together with six other national IC design industrialization bases in the Country. The comprehensive projects of base development is focused on National High Technology Industrial Development Zone, actively works on establishment of a development environment, public technology platform and talent training center. The public technology platform composed with EDA tools, verification and testing, and training platform is the core of base development. It also is the first technical innovation platform of ZheJiang province which is the key components of ZheJiang IC design public technical platform. For more information, please visit http://www.hicc.org.cn.

About Teradyne
Teradyne (NYSE:TER) is a leading supplier of Automatic Test Equipment used to test complex electronics used in the consumer electronics, automotive, computing, telecommunications, and aerospace and defense industries. In 2005, Teradyne had sales of $1.08 billion, and currently employs about 4,000 people worldwide. For more information, visit www.teradyne.com.

Teradyne(R), IG-XL, FLEX and OpenFLEX are trademarks or registered trademarks of Teradyne, Inc. in the US and other countries. All product names are trademarks of Teradyne, Inc. (including its subsidiaries) or their respective owners.