Teradyne - Semiconductor Test Division

Semiconductor Test is a lead-ing supplier of semiconductor test equipment for logic, RF, analog, power, mixed-signal, and memory technologies. We deliver test solutions to developers and manufacturers of a broad range of integrated circuits, packaged separately or integrated as System-On-a-Chip (SOC) or System-In-Package (SIP) devices. ICs tested by Teradyne are used in computing, communications, consumer, automotive, identification, and internet applications.

2010 | 2009 | 2008 | 2007 | 2006 | 2005 | 2004 | 2003 | 2002 | 2001

2002

December 16, 2002
Teradyne's Tiger Selected for National Semiconductor's Next-Generation SOC Device Test

December 9, 2002
Giesecke & Devrient Selects Teradyne's J750k for Design Verification and Qualification of Smart Cards; Open Software Concept Of IG-XL Provides Optimal Support for Design Verification

November 21, 2002
Agere Uses Teradyne's Tiger Test Systems for High-Performance Data Storage System-on-a-Chip Devices

October 17, 2002
VIKO Technology Selects Teradyne's Catalyst for Wireless Test

October 8, 2002
UTAC Orders Multiple Teradyne Catalyst Test Systems with MicroWAVE6000 For Mobile, Wireless and Broadband Applications

October 7, 2002
Teradyne Awarded 2002 Test Solution Supplier of the Year by Magis

September 24, 2002
Toshiba Selects Teradyne's Integra FLEX Test System; Toshiba to Use New Universal Slot Architecture for High-mix Consumer Device Test

September 17, 2002
VIA Technologies Selects Teradyne's Tiger for Chipset Production Test; Rapid Time to Market and Superior Economics Driven by Improved Test Performance

September 16, 2002
SigmaTel Selects Teradyne Integra J750 Test System for Testing of PC Audio Codecs

September 16, 2002
Samsung Chooses Teradyne Tiger for High Speed/High Performance SOC Test

July 26, 2002
Canada's First Test House, DA-Test, Selects Teradyne's Catalyst Featuring MicroWAVE6000; DA-Test provides leading SOC tester for the growing `Silicon Valley of the North'

July 19, 2002
Teradyne's Integra FLEX Chosen as New Tester Platform for Microchip Technology; Universal Slot Architecture and IG-XL Software Enable Flexibility for Product Line Expansion

July 17, 2002
Teradyne's Catalyst and Tiger Testers Certified Embedded Test Ready by LogicVision

July 11, 2002
Teradyne Reduces Test Costs with Performance on Demand™

July 10, 2002
Teradyne Announces RF Micro Devices And STATS To Ramp Bluetooth Device Production On Teradyne's Catalyst Test Systems With MicroWAVE6000

June 25, 2002
Teradyne Improves Integra J750 Accuracy with New Enhanced Digital Channel Board

June 10, 2002
MediaTek Specifies Teradyne Catalyst Test System

May 30, 2002
Shanghai Hua Hong Chooses Teradyne's Integra J750 for Smartcard Test

May 20, 2002
Teradyne Announces Open Architecture Initiative for the New Integra FLEX Test System

May 1, 2002
Teradyne's New Integra FLEX Test System Selected as Next Generation Platform; Universal Slot Architecture Enables Manufacturing Flexibility for Range of Devices

April 15, 2002
Teradyne's Integra J750k Targets Design Verification

March 27, 2002
ITEST, Ltd. Purchases Two Teradyne Integra J750s As First Mixed Signal Test System

March 20, 2002
Teradyne Introduces Integra FLEX; New Universal Slot Architecture Sets a New Standard for Semiconductor Test

March 13, 2002
SPIL Chooses Teradyne's Tiger for Chipset Production Test; Subcontractors Prepare for Future Chipset Device Test With Tiger's Flexible Configuration

February 19, 2002
Infineon Selects Teradyne's MicroWAVE6000 on Catalyst to Test Bluetooth Devices

February 13, 2002
ASE Test Selects Teradyne's Tiger for Improved Test Economics; Improved Economics Driven by Improved Test Performance

February 11, 2002
Teradyne Ships 1000th Catalyst to QUALCOMM

January 31, 2002
Teradyne Introduces AWG LAN for the Catalyst and Tiger Test Systems