Teradyne Semiconductor Test - News Archive 2003

Test Products Contact Information Support Sales Test Cell Products Outsourcing Test About Semiconductor Test Advanced Search \| Site Map Semiconductor Test is a lead-ing supplier of semiconductor test equipment for logic, RF, analog, power, mixed-signal, and memory technologies. We deliver test solutions to developers and manufacturers of a broad range of integrated circuits, packaged separately or integrated as System-On-a-Chip (SOC) or System-In-Package (SIP) devices. ICs tested by Teradyne are used in computing, communications, consumer, automotive, identification, and internet applications.			Home > News Archive 2003 2010 \| 2009 \| 2008 \| 2007 \| 2006 \| 2005 \| 2004 \| 2003 \| 2002 \| 2001 2003 December 11, 2003 Agere Recognizes Teradyne with 2003 Strategic Supplier Award December 3, 2003 Teradyne Japan Hosts Fourth Annual Technical Seminar; Solutions for Improving Test Productivity and Economics September 29, 2003 GuideTech Delivers New Instrument under Teradyne's Open Architecture Initiative; FEMTO instrumentation and FLEX test system combine for fully integrated test solution September 16, 2003 Airoha Technology Selects Teradyne's Catalyst for Wireless Device Test September 15, 2003 Taiwan's Largest Test House, King Yuan Electronics Co., LTD Purchases Multiple Teradyne IP750 Image Sensor Test Systems September 15, 2003 VIA Selects Teradyne's Tiger SSPE and SPQ Options for Next Generation Bus Device Test August 26, 2003 STATS Installs 100th Teradyne Catalyst Platform August 26, 2003 C*Core Selects Teradyne for Testing Its Next Generation Embedded Processor August 12, 2003 ULi Selects Teradyne's Tiger for Chipset Engineering and Production Test July 14, 2003 ASAT Purchases Multiple Teradyne Catalyst Systems July 14, 2003 Teradyne Introduces Tiger Source Synchronous Pin Electronics July 10, 2003 ASET Invests in Multiple Teradyne Tiger SOC Test Systems for Next Generation Device Test July 8, 2003 Marvell Picks Teradyne Tiger for Storage SOC Testing May 12, 2003 Samsung Selects Teradyne for Smart Card Test April 25, 2003 Global Advanced Packaging Technology -GAPT- Purchases Teradyne's Catalyst for a Range of Device Test April 21, 2003 UTAC Teams with Teradyne on Worldwide Semiconductor Industrial Training and Engineering Center -SITEC- Initiative April 14, 2003 ChipPAC Purchases Multiple Teradyne Catalyst Test Systems for Wireless Device Test April 14, 2003 SPIL Orders Multiple Tiger Systems for Graphics Processor and Chipset Production; Tiger's Flexible Configurations and High Throughput Deliver Winning Economics April 1, 2003 Teradyne Introduces High Voltage Digital Option for Automotive/Power Devices; Automotive Device Test for ABS, Airbag or Engine Controller Units March 13, 2003 Vimicro Selects Teradyne for Testing Its Next Generation Digital Image Processor; J750 Chosen for Verification and Production Test at ASAT March 12, 2003 Teradyne Wins Competitive Microcontroller Design-In at Haier; One of the Biggest Home Appliance Manufacturers in the World March 12, 2003 Global Advanced Packaging Technology -GAPT- Selects First Teradyne Tiger Test System in China March 6, 2003 Teradyne Tests Amlogic's Latest DVD Device; Next-Generation Device for DVD Players February 20, 2003 UTAC Selects Teradyne's J750 Mixed Signal Option; Widens Range of Low-Cost Test for Consumer ICs February 10, 2003 Teradyne's Tiger Chosen by ATI Technologies for Graphics and Chipset Engineering and Production Test; Improved Test Performance Drives Superior Economics and Time to Market January 28, 2003 Teradyne's FLEX Test System Awarded Test & Measurement World's 2003 Best in Test; SOC Test Per Pin Architecture Necessary for Emerging Devices