Teradyne Semiconductor Test - News Archive 2005

Test Products Contact Information Support Sales Test Cell Products Outsourcing Test About Semiconductor Test Advanced Search \| Site Map Semiconductor Test is a lead-ing supplier of semiconductor test equipment for logic, RF, analog, power, mixed-signal, and memory technologies. We deliver test solutions to developers and manufacturers of a broad range of integrated circuits, packaged separately or integrated as System-On-a-Chip (SOC) or System-In-Package (SIP) devices. ICs tested by Teradyne are used in computing, communications, consumer, automotive, identification, and internet applications.			Home > News Archive 2005 2010 \| 2009 \| 2008 \| 2007 \| 2006 \| 2005 \| 2004 \| 2003 \| 2002 \| 2001 2005 December 7, 2005 Teradyne's J750 Adopted by NEC Electronics for Microcontroller Device Test October 13, 2005 Atheros Purchases Teradyne FLEX System for Quad-Site Production Device Test Teradyne’s Gen4 Microwave tests single-chip Personal Handyphone System device October 11, 2005 Teradyne Celebrates Chung Yuan Christian University’s 50-Year Anniversary Test system donation creates new educational opportunities for students September 20, 2005 Teradyne UltraFLEX Selected for Next-Generation Video Graphics Device Test by Micronas August 23, 2005 UTAC Running Volume Device Test Production on Teradyne UltraFLEX High performance test system extends FLEX Platform family August 9, 2005 AMI Semiconductor Selects Teradyne FLEX Test Platform Global mixed-signal device manufacturer purchases microFLEX systems for development and production test July 28, 2005 UTAC Strengthens Wireless Test Capability with Teradyne FLEX for Microwave Test July 7, 2005 Teradyne Announces ATE Industry's First Universal Slot Open Architecture Solution June 2, 2005 MediaTek Expands Use of Teradyne's FLEX Platform for Next-Generation Test; Subcontractors Purchase Multiple FLEX Systems May 11, 2005 Global Testing Selects Teradyne IP750EP Image Sensor Test System for Silicon Valley Installation April 14, 2005 CSR Purchases Multiple Teradyne FLEX Systems for Wireless Device Test March 14, 2005 Beijing Huada Orders Additional Teradyne J750 Systems for RFID Smart Card Testing March 14, 2005 Actions Semiconductor Orders Multiple Teradyne J750 Systems for Audio IC Testing February 23, 2005 Teradyne's FLEX Test Platform Expands in Japan; New Small System Form Factor for Next-Generation Device Test Introduced February 23, 2005 Teradyne Hosts Next-Generation SOC Testing Event; Japanese Electronics Industry Leaders Share Insights