Teradyne - Semiconductor Test Division

Semiconductor Test is a lead-ing supplier of semiconductor test equipment for logic, RF, analog, power, mixed-signal, and memory technologies. We deliver test solutions to developers and manufacturers of a broad range of integrated circuits, packaged separately or integrated as System-On-a-Chip (SOC) or System-In-Package (SIP) devices. ICs tested by Teradyne are used in computing, communications, consumer, automotive, identification, and internet applications.

 

2004

May 17, 2004
Teradyne and ASE Announce Strategic Agreement Including Volume Purchase of Teradyne Test Systems

January 6, 2004
SAMSUNG Purchases Multiple Teradyne Tigers for Multi-Site Probe of Broadband Devices

 

2003

December 11, 2003
Agere Recognizes Teradyne with 2003 Strategic Supplier Award

September 15, 2003
VIA Selects Teradyne's Tiger SSPE and SPQ Options for Next Generation Bus Device Test

August 12, 2003
ULi Selects Teradyne's Tiger for Chipset Engineering and Production Test

July 14, 2003
Teradyne Introduces Tiger Source Synchronous Pin Electronics

July 10, 2003
ASET Invests in Multiple Teradyne Tiger SOC Test Systems for Next Generation Device Test

July 8, 2003
Marvell Picks Teradyne Tiger for Storage SOC Testing

April 14, 2003
SPIL Orders Multiple Tiger Systems for Graphics Processor and Chipset Production; Tiger's Flexible Configurations and High Throughput Deliver Winning Economics

March 12, 2003
Global Advanced Packaging Technology -GAPT- Selects First Teradyne Tiger Test System in China

February 10, 2003
Teradyne's Tiger Chosen by ATI Technologies for Graphics and Chipset Engineering and Production Test; Improved Test Performance Drives Superior Economics and Time to Market

 

2002

Dec. 16, 2002
Teradyne's Tiger Selected for National Semiconductor's Next-Generation SOC Device Test

Nov. 21, 2002
Agere Uses Teradyne's Tiger Test Systems for High-Performance Data Storage System-on-a-Chip Devices

Sept. 17, 2002
VIA Technologies Selects Teradyne's Tiger for Chipset Production Test; Rapid Time to Market and Superior Economics Driven by Improved Test Performance

Sept. 16, 2002
Samsung Chooses Teradyne Tiger for High Speed/High Performance SOC Test

August 5, 2002
AMCC Presents Teradyne with Technology and Innovation Award; Second Annual AMCC Super Suppliers Award Ceremony

July 17, 2002
Teradyne's Catalyst and Tiger Testers Certified Embedded Test Ready by LogicVision

July 11, 2002
Teradyne Reduces Test Costs with Performance on Demand-TM-

March 13, 2002
SPIL Chooses Teradyne's Tiger for Chipset Production Test; Subcontractors Prepare for Future Chipset Device Test With Tiger's Flexible Configuration

Feb. 13, 2002
ASE Test Selects Teradyne's Tiger for Improved Test Economics; Improved Economics Driven by Improved Test Performance

Jan. 29, 2002
Teradyne's MicroWAVE6000 Selected to Test Intersil's PRISM Indigo WLAN Chip Sets

 

2001

Aug. 20, 2001
Applied Micro Circuits Corporation Selects Teradyne's Tiger; Meeting Next Generation IC Test Requirements, Today

July 23, 2001
ISE Labs Teams Up with Teradyne to Provide Engineering and Production Services on Tiger Test Systems; Prepares to Test Tomorrow's High-Performance Devices

July 18, 2001
Teradyne Demonstrates New Full Differential Digital on Tiger; Performance Economics for Emerging Technologies

July 18, 2001
Aeroflex UTMC Selects Catalyst Tiger and J750k Test Systems from Teradyne

July 11, 2001
UTAC Places Order for Multiple Teradyne Tiger Test Systems; Subcontractors Prepare to Test Tomorrow's High-Performance Devices With Tiger

June 21, 2001
Agere Systems Selects New Teradyne Tiger

June 12, 2001
AMD Purchases Tiger Test Systems for Next Generation Devices with HyperTransport Technology

May 7, 2001
Mellanox Technologies Selects Teradyne's Tiger to Test Its Multi-Gigabit InfiniBand Devices

Jan. 22, 2001
Teradyne Tiger To Test ASE Test's SOC Devices; First SOC Test System with Digital I/O over 1 Gigabit/sec to Provide Enhanced Test Capacity to World's SOC Devices