BOSTON--(BUSINESS WIRE)--Aug. 20, 2001--Teradyne Inc. (NYSE:TER) announced today that Applied Micro Circuits Corporation (AMCC), a leader in the design and manufacture of high-performance silicon solutions for optical networks, has selected Teradyne's Tiger for at- speed testing of their next-generation devices.

AMCC utilizes a combination of high-frequency analog, mixed-signal and digital design, coupled with multiple silicon process technologies to offer integrated circuit products that enable the transport of voice and data over fiber optics networks. Tiger delivers economical at-speed testing for leading edge devices by incorporating 1024 digital pins with Real I/O(tm) data rates to 1.6 Gbps in an SOC system designed for high throughput testing of tomorrow's SerDes devices.

"AMCC's integration path of SerDes cells into VLSI devices is happening today," said Jim Icuss, director of Semiconductor Development, AMCC. "Tiger can support our current test needs, while providing future versatility and headroom to increase pin count, add mixed-signal instruments and increase digital speed. AMCC's next-generation silicon will be introduced later this year, and we are pleased Tiger will be there enabling a faster time-to-market for AMCC's customers."

"The recent selection of Tiger is an expansion of the Catalyst family for AMCC," said Ellen Eisele, Tiger product manager at Teradyne. "IMAGE(tm), the environment for both Catalyst and Tiger, leverages AMCC's test engineering expertise across the family of Teradyne systems for fast time-to-market and industry leading throughput. We look forward to continuing the development of shared test solutions with AMCC to meet the demands of testing next generation high speed port devices."

About Tiger

Tiger is the first over 1 Gbps SOC test system. Extending the Catalyst family, Tiger shares the same high throughput zero-time DSP architecture, IMAGE(tm) software, and state-of-the-art analog instruments. Powered by breakthrough Silicon Germanium (SiGe) technology, Tiger sets the standard with Real I/O(tm) data rates to 1.6 Gbps. Real I/O gives better fault coverage and shorter test times through functional and timing margin checks in a single pattern burst, at any digital data rate.

About AMCC

AMCC designs, develops, manufactures and markets high-performance, high-bandwidth silicon solutions for the world's optical networks. AMCC utilizes a combination of high-frequency analog, mixed-signal and digital design expertise coupled with system-level knowledge and multiple silicon process technologies to offer integrated circuit products that enable the transport of voice and data over fiber optic networks. The company's system solution portfolio includes PMD, PHY, framer/mapper, network processor, traffic management and switch fabric devices that address the high-performance needs of the evolving intelligent optical network. AMCC's corporate headquarters and wafer fabrication facilities are located in San Diego. Sales and engineering offices are located throughout the world. For further information regarding AMCC, please visit their Web site at http://www.amcc.com or call the shareholder information line at 888/982-AMCC (2622).

About Teradyne

Teradyne (NYSE:TER) is the world's largest supplier of automatic test equipment and is also a leading supplier of high performance interconnection systems. Teradyne's test products are used by manufacturers of semiconductors, circuit assemblies, voice and broadband telephone networks. Teradyne's backplane assemblies and high-density connectors are used by manufacturers of communications and computing systems central to building networking infrastructure. The company had sales of $3.0 billion in 2000 and currently employs about 9000 people worldwide. For more information visit www.teradyne.com.

IMAGE and Real I/O are trademarks of Teradyne Inc.