BOSTON--(BUSINESS WIRE)--Sept. 17, 2002--Teradyne, Inc. (NYSE:TER) announced today that VIA Technologies, Inc., a leading developer of PC core logic chipsets, microprocessors, multimedia and communications chips, has selected Teradyne's Tiger test system as one of the characterization and production solutions for the full range of devices manufactured by their diverse subcontractor base.

Fabless device designers, like VIA, select the Tiger because the system's unique combination of 3rd Generation SOC Architecture and Real I/O (TM) digital pattern generation capability, with dual independent time bases, ensures rapid time-to-market and economical, at-speed test capability for emerging devices that include multiple high-speed interface standards. The Tiger's TwinMode(TM) digital pin electronics architecture is capable of full functional test (including single-ended, differential, and common mode drive and compare) on any pin. Combined with the SerDes Port Qualifier, which delivers the full suite of SerDes jitter characterization tests with production efficiencies, the Tiger provides a comprehensive test solution for next generation high-speed data ports including HyperTransport(TM), DDR I/O, PCI Express, Serial ATA, and other LVDS and SerDes technologies.

"To be a leader in the semiconductor market today, we must continue to quickly develop test solutions for emerging device technologies like HyperTransport and PCI Express, while achieving high volume and low cost in production," said Shelton Lu, Vice President of MPE, VIA Technologies, Inc. "With device I/O data rates exceeding 600 Mbps, we need testers with the ability to minimize test time and time to market. Teradyne's Tiger reduces test time because all the I/O waveforms required to fully test the part can be generated in a single pattern burst - waveforms do not have to be reloaded and patterns do not have to be rerun. Teradyne's Tiger meets VIA's roadmap for high-speed digital testing. This is a continuation of extending partnership with ATE industry leaders to deploy advanced technologies over high-speed IC volume production. Only with strong ATE partners can VIA focus on core competencies and catch up with a fast changing market migration path."

"Today, the testing market is very complex as LVDS buses, DDR I/O and SerDes interfaces are rapidly being integrated onto high-performance digital parts," said Glenn Farris, Marketing Manager, Teradyne. "HyperTransport(TM) buses, for example, are moving onto Chipsets, Microprocessors and Network Processors. The number of buses varies per device resulting in a range of differential channels required per device. Teradyne's Tiger test system can provide a unique advantage in this very competitive market. The Tiger's TwinMode Pin Electronics can be used for single-ended pins, or can be used for all tests (single-ended, differential and common mode) for the differential pins. VIA has developed the reputation as a market leader in Chipsets and we are pleased that they have chosen the Tiger to strengthen their position in the broader semiconductor market."

About Tiger

The Catalyst Tiger is the first ATE Platform to combine next generation LVDS and SerDes production test capability in a true SOC system. Extending the Catalyst Family, Tiger shares the same high throughput zero-time DSP architecture, IMAGE(TM) software and state-of-the-art analog instruments and extends the Catalyst Family to 1024 digital pins. Powered by breakthrough Silicon Germanium (SiGe) technology, Tiger's TwinMode Pin Electronics set a new digital performance standard with full I/O data rates to 1.6 Gbps and configurability for single ended or differential testing, while retaining the timing flexibility at top speed demanded by chipset and network processing applications. The flexibility of Tiger allows customers to configure their system to provide complete test coverage while achieving maximum production throughput for a broad range of devices.

About VIA Technologies

VIA Technologies, Inc. is a leading innovator and developer of PC core logic chipsets, microprocessors, and multimedia and communications chips. VIA delivers value to the PC industry by designing, marketing, and selling high-performance discrete and integrated core logic chipsets for the full range of PC platforms, as well as power efficient VIA C3(TM) processors. VPSD, an autonomous Business Unit within VIA, is charged with the mission of designing, developing, and bringing to market a complete range of platform solutions, including a new line of branded VIA Mainboards, as well as the company's Information PC, Set Top Box, Web Pad and future Total Connectivity designs. VIA is headquartered in Taipei, Taiwan. The company is listed on the Taiwan Stock Exchange (TSE2388), and achieved annual revenues of nearly US$1 billion in 2000.

About Teradyne

Teradyne (NYSE: TER) is the world's largest supplier of automatic test equipment and is also a leading supplier of high performance interconnection systems. Teradyne's test products are used by manufacturers of semiconductors, circuit assemblies, voice and broadband telephone networks. Teradyne's backplane assemblies and high-density connectors are used by manufacturers of communications and computing systems central to building networking infrastructure. The company had sales of $1.4 billion in 2001 and currently employs about 8000 people worldwide. For more information visit www.teradyne.com.

IMAGE and TwinMode are trademarks of Teradyne, Inc.

HyperTransport is a trademark of the HyperTransport Technology Consortium.