Semiconductor Test is a lead-ing supplier of semiconductor test equipment for logic, RF, analog, power, mixed-signal, and memory technologies. We deliver test solutions to developers and manufacturers of a broad range of integrated circuits, packaged separately or integrated as System-On-a-Chip (SOC) or System-In-Package (SIP) devices. ICs tested by Teradyne are used in computing, communications, consumer, automotive, identification, and internet applications. |
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SPIL
Orders Multiple Tiger Systems for Graphics Processor
and Chipset Production; Tiger's Flexible Configurations
and High Throughput Deliver Winning Economics
BOSTON--(BUSINESS WIRE)--April 14, 2003--Teradyne, Inc. (NYSE:TER) announced today that Siliconware Precision Industries Co., Ltd. (NASDAQ: SPIL), a leading global IC packaging and testing group, has purchased multiple Tiger systems further expanding their Tiger installed base for production test of Graphics Processors and Chipsets. Subcontractors like SPIL are standardizing on Tiger because its comprehensive Digital and Analog instrument suite, integrated in a 3rd generation SOC architecture, flexibly delivers the performance, throughput and yield required for the full spectrum of computing devices. With Tiger, SPIL can provide highly efficient test solutions for a wide range of Fabless designers and IDMs, all on a single test platform. "Interface technologies and data rates on Graphics and Chipset devices continue to escalate," commented Bough Lin, Chairman, Siliconware Precision Industries Co., Ltd. "Proven test solutions that minimize test time and reduce time to market are needed for new HyperTransport™ and PCI Express test applications. Teradyne's expertise in HyperTransport and SerDes, coupled with their wide acceptance among Fabless designers, enables SPIL to deliver a highly reliable solution to a broad set of customers." Tiger's unique Real I/O™ Dual Asynchronous Pattern Generators, using silicon germanium technology, deliver full I/O switching for high speed I/O buses at up to 1.6Gbps enabling high throughput test of next generation high-performance graphics processors and chipsets. All the I/O waveforms required to fully test the part can be generated in a single pattern burst. Waveforms do not have to be reloaded and patterns do not have to be rerun, reducing test time. Critical "data eye" measurements for high-speed interfaces such as TMDS are done in a single pattern pass. Teradyne's Tiger enables test time advantages of over 20-30%, versus other ATE systems without this timing flexibility, and with the availability of these high-speed test features, program development times are reduced from months to weeks. Tiger's TwinMode™ pin electronics architecture delivers full functional test capability (including single ended, differential, and common mode drive and compare) on any pin. This configuration flexibility makes it easier to test emerging devices that include multiple high-speed interface standards. "HyperTransport, 1Gbps DDR I/O, and high speed Serial interfaces like S-ATA and PCI Express are rapidly being integrated onto high performance digital parts. We are pleased to provide subcontractors, like SPIL, the advantage of a flexible test suite that minimizes the total number of channel cards, matches tester performance and cost to the needs of the device, and provides comprehensive testing of all device specifications in a single insertion," said Glenn Farris, Product Marketing Manager, Teradyne. "In addition, we are pleased to provide extensive system and program support ensuring SPIL's success with Tiger," concluded Michael Wu, Sales Account Manager, Teradyne. About Tiger Catalyst Tiger is the first over 1 Gbps SOC test system. Extending the Catalyst Family, Tiger offers the flexibility and scalability required by leading Fabless subcontractors and integrated device manufacturers by providing economical at-speed testing for a variety of leading edge devices. Tiger offers up to 1024 digital pins and data rates to 3.2Gbps while combining unequaled analog test capability, timing flexibility, and programmable speed enabling all in one versatile platform. About Siliconware Precision Industries, Co. Ltd. Siliconware (NASDAQ: SPIL) is a worldwide leading semiconductor backend supplier with one-stop assembly and testing total solutions. The company provides QFP, LQFP, BGA, CSP, Module packages, as well as bumping and flip chip for high-end applications. Siliconware is headquartered at No. 123, Sec. 3, Da-Fong Road, Tantzu, Taichung, Taiwan, R.O.C. 886-4-25341525, http://www.spil.com.tw. About Teradyne Teradyne (NYSE:TER) is the world's largest supplier of Automatic Test Equipment, and a leading supplier of interconnection systems. The company's products deliver competitive advantage to the world's leading semiconductor, electronics, automotive and network systems companies. In 2002, Teradyne had sales of $1.22 billion, and employed about 7000 people worldwide. For more information, visit www.teradyne.com. IMAGE and TwinMode are trademarks of Teradyne, Inc.
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