Semiconductor Test is a lead-ing supplier of semiconductor test equipment for logic, RF, analog, power, mixed-signal, and memory technologies. We deliver test solutions to developers and manufacturers of a broad range of integrated circuits, packaged separately or integrated as System-On-a-Chip (SOC) or System-In-Package (SIP) devices. ICs tested by Teradyne are used in computing, communications, consumer, automotive, identification, and internet applications. |
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VIA Selects Teradyne's Tiger SSPE and SPQ Options for Next Generation Bus Device Test TAIPEI, Taiwan--(BUSINESS WIRE)--Sept. 15, 2003-- New technologies achieve unmatched throughput and performance for PCI Express,™ HyperTransport™ and Front Side Bus Teradyne, Inc. (NYSE:TER) announced today that VIA Technologies, Inc., a leading developer of PC core logic chipsets, microprocessors, multimedia and communications chips, has selected Teradyne's Tiger Source Synchronous Pin Electronics (SSPE) and SerDes Port Qualifier (SPQ) options to expand their capability for next generation interface test. VIA will be using Teradyne's SSPE option to meet the at-speed functional test requirements of source synchronous buses exceeding Gbps data rates. The SPQ option, combined with Tiger's GigaDig option, will be used for characterization and production test of embedded clock interfaces by precisely injecting and measuring jitter parameters. "Teradyne has been and continues to be a long term technology partner of VIA," said Shelton Lu, Manufacturing and Product Engineering Division of VIA. "The Tiger with SSPE and SPQ represents a significant milestone in performance that will successfully enable the production ramp of new technologies such as the gigabit Intel®Pentium® 4 front side bus, PCI Express, and HyperTransport." The involvement of key technology partners in development and validation of the SSPE architecture has been essential to optimizing its implementation for the market. Multiple high-speed bus architectures are emerging to answer the increasing demand for data bandwidth. Source synchronous parallel differential buses, such as HyperTransport and Rapid IO™, are rapidly being integrated onto chipsets, microprocessors and network processors. Higher speed parallel I/O interconnects, such as DDR memory buses and the Intel® Pentium® 4 front side bus, are achieving data rates of more than one gigabit-per-second. Embedded clock interfaces, such as S-ATA and PCI Express are proliferating onto all core logic devices. Teradyne's Tiger SSPE delivers the most accurate functional test solution for these unidirectional differential and single-ended I/O buses, while SPQ with GigaDig enables comprehensive hi-throughput parametric jitter verification and measurement both in production and the lab. According to Glenn Farris, Computing Marketing Manager, "Tiger with SSPE and Real I/O™ pattern generation provides single-ended or differential signals covering all device waveform and time domain combinations, while tracking same cycle source synchronous device output clocks and correctly interpreting embedded clock packet information at data rates up to 3.2Gbps. SPQ enables precise control of the data eye entering the Rx input of embedded clock interfaces while the Gigadig precisely measures the jitter parameters of the Tx output port." In benchmark evaluations, Tiger consistently enables test time advantages of 20-30% versus other ATE systems without this flexibility, while the SSPE and SPQ improve test quality and enable higher yield and lower cost. About Tiger Catalyst Tiger is the first over 1 Gbps SOC test system. Extending the Catalyst Family, Tiger offers the flexibility and scalability required by leading Fabless subcontractors and integrated device manufacturers by providing economical at-speed testing for a variety of leading edge devices. Tiger offers up to 1264 digital pins and data rates to 3.2Gbps while combining unequaled analog test capability, timing flexibility, and programmable speed enabling all in one versatile platform. About VIA Technologies VIA Technologies, Inc. is a leading innovator and developer of PC core logic chipsets, microprocessors, and multimedia and communications chips. VIA delivers value to the PC industry by designing, marketing, and selling high-performance discrete and integrated core logic chipsets for the full range of PC platforms, as well as power efficient VIA C3™ processors. VPSD, an autonomous Business Unit within VIA, is charged with the mission of designing, developing, and bringing to market a complete range of platform solutions, including a new line of branded VIA Mainboards, as well as the company's Information PC, Set Top Box, Web Pad and future Total Connectivity designs. VIA is headquartered in Taipei, Taiwan. The company is listed on the Taiwan Stock Exchange (TSE2388), and achieved annual revenues of nearly US$1 billion in 2000. About Teradyne Teradyne (NYSE:TER) is the world's largest supplier of Automatic Test Equipment, and a leading supplier of interconnection systems. The company's products deliver competitive advantage to the world's leading semiconductor, electronics, automotive and network systems companies. In 2002, Teradyne had sales of $1.22 billion, and currently employs about 6800 people worldwide. For more information, visit www.teradyne.com. HyperTransport is a trademark of the HyperTransport
Technology Consortium.
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