Teradyne - Semiconductor Test Division

Semiconductor Test is a lead-
ing supplier of semiconductor test equipment for logic, RF, analog, power, mixed-signal, and memory technologies. We deliver test solutions to developers and manufacturers of a broad range of integrated circuits, packaged separately or integrated as System-On-a-Chip (SOC) or System-In-Package (SIP) devices. ICs tested by Teradyne are used in computing, communications, consumer, automotive, identification, and internet applications.

 

spacer
  Home > News  

Teradyne FLEX Chosen to Support Unisem's Fabless Customers in Europe

NORTH READING, Mass. – March 3, 2009 – Teradyne, Inc. (NYSE:TER) announced that Unisem Group, a global provider of semiconductor assembly and test services for many of the world's most successful electronics companies, purchased a Teradyne® FLEX™ test system with BBAC™ and DC75 instrumentation to test baseband and network devices for wireless and optical modems. The system will support Unisem’s fabless customers throughout Europe.

“We chose the FLEX due to its wide range of instrumentation, from power management to RF,” said C.H. Ang, chief operating officer, Unisem Group. “The flexibility of the system allows it to be configured to test a particular mix of devices and then, as test requirements change, the system can be quickly adapted by adding or relocating instrumentation. This allows us to get new devices to market faster while achieving lowest cost of test.”

“We are pleased that Unisem, a long time Teradyne customer, has chosen the FLEX,“ said Bill Schymik, FLEX platform manager, Teradyne. “With FLEX, you optimize your capital investment while achieving superior performance and throughput across the widest range of device technologies-including digital, analog, DC, RF and memory.”

Teradyne’s FLEX test family, approaching 2000 test systems shipped, advances test technologies in an architecture designed for high-efficiency, multisite test. The FLEX family readily adapts to new test requirements. With a Universal Slot architecture and high-density instrument design, test engineers can dynamically match system configurations to changing production requirements on the test floor. To learn more about the FLEX Platform, visit http://www.teradyne.com/flex/.

About Unisem
Unisem is a global provider of semiconductor assembly and test services for many of the world’s most successful electronics companies. Unisem offers an integrated suite of packaging and test services such as wafer bumping, wafer probing, wafer grinding, a wide range of lead frame and substrate IC packaging, wafer level CSP and RF, analog, digital and mixed-signal test services. Our turnkey services include design, assembly, test, failure analysis, and electrical and thermal characterization. With approximately 9,500 employees worldwide, Unisem has factory locations in Ipoh, Malaysia; Wales, United Kingdom; Chengdu, People’s Republic of China; Batam, Indonesia and Sunnyvale, USA. The company is headquartered in Kuala Lumpur, Malaysia. For more information about Unisem, please visit www.unisemgroup.com.

About Teradyne
Teradyne (NYSE:TER) is a leading supplier of Automatic Test Equipment used to test complex electronics used in the consumer electronics, automotive, computing, telecommunications, and aerospace and defense industries. In 2008, Teradyne had sales of $1.1 billion and currently employs about 3,300 people worldwide. For more information, visit www.teradyne.com. Teradyne® is a registered trademark of Teradyne, Inc. in the U.S. and other countries. All product names are trademarks of Teradyne, Inc. (including its subsidiaries).

###

Editor’s Note: For product photography and other resources, please visit Teradyne’s press room at:  http://www.teradyne.com/pressRoom/index.html