Teradyne - Semiconductor Test Division

Semiconductor Test is a lead-
ing supplier of semiconductor test equipment for logic, RF, analog, power, mixed-signal, and memory technologies. We deliver test solutions to developers and manufacturers of a broad range of integrated circuits, packaged separately or integrated as System-On-a-Chip (SOC) or System-In-Package (SIP) devices. ICs tested by Teradyne are used in computing, communications, consumer, automotive, identification, and internet applications.

 
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Teradyne Introduces Five New Products in Five Months

NORTH READING, MA – July 14, 2008 – Teradyne, Inc. (NYSE:TER) has introduced five new products in the past five months, offering its customers solutions to lower cost of test while increasing their flexibility to test current and emerging SOC and memory technology. All the new products are already in production with customers.

Introductions include the UltraWave™12G wireless test instrument, the high density UltraPin800™ instrument, the small footprint UltraFLEX-HD™ test system, the D750Ex™ LCD driver test system, and the Magnum II™ memory test system for Flash and embedded memory.

  • UltraWave 12G: UltraWave 12G offers the highest port count and a unique tool set, enabling fastest high site count parallel test of complex RF SOC devices, including wireless LAN, Bluetooth®, 3G cellular, and new emerging standards like 4G cellular and Ultrawideband. Teradyne has multiple orders for the UltraWave 12G from several customers, helping the company build on its leadership in wireless SOC test.

  • UltraPin800: UltraPin800 digital instrument extends the parallel test capability of the UltraFLEX™ family of test systems by doubling the number of pins per instrument.  Teradyne has delivered more than 100 UltraPin800 instruments to customers in North America, Europe and Asia.

  • UltraFLEX-HD: UltraFLEX-HD is the newest member of the UltraFLEX family of test systems, and supports existing UltraFLEX instrumentation in a compatible small footprint 12 slot test system. The UltraFLEX-HD is currently installed at multiple customers, supporting RF and broadband applications.

  • D750Ex: The new D750Ex LCD driver test system provides a true high density resource per pin architecture that supports over 97 percent parallel test efficiency. The smaller-footprint D750Ex, which builds on the more than 2700 J750 systems shipped, also features both an embedded DSP and central DSP architecture to improve processing throughput. Himax Technologies Limited has selected the platform for testing their next generation column and mobile driver devices.

  • Magnum II: Based on the successful Magnum I architecture, the Magnum II delivers a new level of performance and test efficiency required to satisfy the higher speeds and performance requirements of Flash and embedded memory systems. Magnum II is compatible with the successful Magnum 1, which has more than 1,600 systems installed worldwide. Teradyne’s Nextest business unit has already shipped Magnum II to customers.

About Teradyne
Teradyne (NYSE:TER) is a leading supplier of Automatic Test Equipment used to test complex electronics used in the consumer electronics, automotive, computing, telecommunications, and aerospace and defense industries. In 2007, Teradyne had sales of $1.1 billion and currently employs about 3,600 people worldwide. For more information, visit www.teradyne.com. Teradyne® is a registered trademark of Teradyne, Inc. in the U.S. and other countries. All product names are trademarks of Teradyne, Inc. (including its subsidiaries).

Bluetooth is a registered trademark of Bluetooth SIG, Inc.

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Editor’s Note: For product photography and other resources, please visit Teradyne’s press room at:  http://www.teradyne.com/pressRoom/index.html