NORTH READING, Mass. – October 13, 2009 – Teradyne (NYSE: TER) announced the signing of an exclusive development agreement with Teseda Corporation to produce Scan Workbench™, a next-generation portable scan debug and yield enhancement tool. Based on industry-standard data protocols and the existing Teseda Workbench™ (TWB) and Diagnostic Manager™ (DM) products, Scan Workbench will allow test engineers to better perform rapid silicon debug, design validation, failure analysis and yield monitoring resulting in decreased time-to-market and improved profitability.

Scan Workbench provides a consistent debug and optimization environment based on IEEE 1450.0-1999 Standard Test Interface Language (STIL) and the new STDF V4-2007 datalog standards. The software will initially be deployed on the Teradyne FLEX® and J750 platforms which will provide Scan Workbench with access to an installed base of over 5,000 testers. The new toolset will be shipping in the second half of 2010.

"Teradyne is committed to making the industry’s leading productivity tools available to our customers by creating standards-based interfaces to the IG-XL™ software environment," noted Rod Stewart, general manager, Teradyne SOC Business unit. "This expanded collaboration with Teseda provides capability that will allow Teradyne customers to improve time–to-market and device yields for devices that use increasingly smaller silicon geometries. We believe the best way to serve our customers is by supporting new tools that improve test efficiency from any vendor as they become available."

“We are pleased to be working with Teradyne to help define, develop and jointly market Teseda’s new Scan Workbench toolset,” said Armagan Akar, Teseda president and CEO. “The partnership allows us to work with the industry leader in ATE to offer our next-generation scan diagnostic tools to the largest potential market—the FLEX family and J750 installed base. In this ultra-competitive market, we concur with Teradyne’s unique approach to support EDA- and ATE-agnostic tools in the marketplace. “

About Teradyne’s Third Party Solution Provider Program
Teradyne ’s Third Party Solution Provider Program allows Teradyne to partner with best-in-class, independent solutions developers to provide the most flexible solutions for their customers. Rather than limit customers' range of options, the program seeks to align Teradyne’s technology and marketing efforts with those of top solutions providers in the fields of automatic test program generation, factory automation, test optimization and yield analysis and enhancement.  Teradyne supports these partners with its worldwide sales and application teams to provide a consistent and reliable implementation strategy for our customers whether they purchased products from Teradyne or the original product developer.

About Teseda
Teseda’s products leverage Design For Test (DFT) techniques to enable its customers accelerated first silicon debug, reduced manufacturing ramp time, shortened failure analysis cycle time and improved yields. Teseda manufactures hardware and software solutions that capitalize on native scan structures within the circuit design to shorten the time to debug and accelerate time to market. Founded in 2001, Teseda is headquartered in Portland, Oregon.  For more information, visit www.teseda.com.

About Teradyne
Teradyne (NYSE:TER) is a leading supplier of Automatic Test Equipment used to test complex electronics used in the consumer electronics, automotive, computing, telecommunications, and aerospace and defense industries. In 2008, Teradyne had sales of $1.1 billion and currently employs about 3,000 people worldwide. For more information, visit www.teradyne.com. Teradyne® is a registered trademark of Teradyne, Inc. in the U.S. and other countries. All product names are trademarks of Teradyne, Inc. (including its subsidiaries).

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