Teradyne - Semiconductor Test Division

Semiconductor Test is a lead-
ing supplier of semiconductor test equipment for logic, RF, analog, power, mixed-signal, and memory technologies. We deliver test solutions to developers and manufacturers of a broad range of integrated circuits, packaged separately or integrated as System-On-a-Chip (SOC) or System-In-Package (SIP) devices. ICs tested by Teradyne are used in computing, communications, consumer, automotive, identification, and internet applications.

 

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SEMICON West 2007

 
TERADYNE AT 
SEMICON West 2007
SEMI TEST SUMMIT
SEMICON West Test Summit
When: Wednesday, July 18, 5:30 - 7 pm, Sponsored by Teradyne
Where: Test, Assembly, and Packaging TechXPOT Stage, West Hall, Level 2
Featuring Mark Jagiela, President, Teradyne Semiconductor Test Division
Top executives from leading semiconductor ATE companies - Teradyne, Advantest America, Credence, Nextest, and Verigy - will join test authority and moderator Rick Nelson, Chief Editor of "Test & Measurement World" magazine, in a discussion focused on meeting the design, test, and yield requirements for advanced semiconductor manufacturing.
For more information, click here.
 
Test, Assembly & Packaging TechXPOT
SEMICON West Tech Xpot
When: Tuesday, July 17, 3 - 5 pm, Sponsored by Teradyne
Where: Test, Assembly, and Packaging TechXPOT stage, West Hall, Level 2
"Critical Issues in Test"
The intensely competitive market of consumer electronics has made test and system integration into critical enabling technologies for successful product development and introduction. Leaders in test technologies have successfully taken on these challenges and will shed some light on how the various test tools and methods need to go together holistically to achieve optimal results.
Featuring Ken Harvey, Senior Product Technologist, Teradyne Semiconductor Test Division
Teradyne Presentation at 4 pm: "Testing Converging Technologies: The Wireless Test Challenge"
For more information, click here.