Semiconductor Test is a lead-
ing supplier of semiconductor test equipment for logic, RF, analog,
power, mixed-signal, and memory technologies. We deliver test solutions
to developers and manufacturers of a broad range of integrated
circuits, packaged separately or integrated as System-On-a-Chip (SOC)
or System-In-Package (SIP) devices. ICs tested by Teradyne are used in
computing, communications, consumer, automotive, identification, and
internet applications.
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TERADYNE AT |
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| SEMI TEST SUMMIT |
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| When: |
Wednesday, July 18, 5:30 - 7 pm, Sponsored by Teradyne |
| Where: |
Test, Assembly, and Packaging TechXPOT Stage, West Hall, Level 2 |
Featuring Mark Jagiela, President, Teradyne Semiconductor Test Division
Top executives from leading semiconductor ATE companies - Teradyne, Advantest America, Credence, Nextest, and Verigy - will join test authority and moderator Rick Nelson, Chief Editor of "Test & Measurement World" magazine, in a discussion focused on meeting the design, test, and yield requirements for advanced semiconductor manufacturing. |
| For more information, click here. |
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| Test, Assembly & Packaging TechXPOT |
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| When: |
Tuesday, July 17, 3 - 5 pm, Sponsored by Teradyne |
| Where: |
Test, Assembly, and Packaging TechXPOT stage, West Hall, Level 2 |
"Critical Issues in Test"
The intensely competitive market of consumer electronics has made test and system integration into critical enabling technologies for successful product development and introduction. Leaders in test technologies have successfully taken on these challenges and will shed some light on how the various test tools and methods need to go together holistically to achieve optimal results. |
Featuring Ken Harvey, Senior Product Technologist, Teradyne Semiconductor Test Division
Teradyne Presentation at 4 pm: "Testing Converging Technologies: The Wireless Test Challenge" |
| For more information, click here. |
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